Author's Latest Posts


Potential Of 2D Semi-Metallic PtSe2 As Source/Drain Contacts For 2D Material FETs


A technical paper titled “Improvement of Contact Resistance and 3D Integration of 2D Material Field-Effect Transistors Using Semi-Metallic PtSe2 Contacts” was published by researchers at Yonsei University, Korea Advanced Institute of Science and Technology (KAIST), Lincoln University College, Korea Institute of Science and Technology (KIST), and Ewha Womans University. Abstract: "In this ... » read more

Freeing Up Near-Memory Capacity For Cache Using Compression Techniques In A Flat Hybrid-Memory Architecture


A technical paper titled “HMComp: Extending Near-Memory Capacity using Compression in Hybrid Memory” was published by researchers at Chalmers University of Technology and ZeroPoint Technologies. Abstract: "Hybrid memories, especially combining a first-tier near memory using High-Bandwidth Memory (HBM) and a second-tier far memory using DRAM, can realize a large and low cost, high-bandwi... » read more

Electrochemical RAM Cross-Point Arrays For An Analog DL Accelerator


A technical paper titled “Retention-aware zero-shifting technique for Tiki-Taka algorithm-based analog deep learning accelerator” was published by researchers at Pohang University of Science and Technology, Korea University, and Kyungpook National University. "We present the fabrication of 4 K-scale electrochemical random-access memory (ECRAM) cross-point arrays for analog neural network... » read more

Data Filtering Directly Within A NAND Flash Memory Chip


A technical paper titled “Search-in-Memory (SiM): Reliable, Versatile, and Efficient Data Matching in SSD's NAND Flash Memory Chip for Data Indexing Acceleration” was published by researchers at TU Dortmund, Academia Sinica, and National Taiwan University. "This paper introduces the Search-in-Memory (SiM) chip, which demonstrates the feasibility of performing data filtering directly with... » read more

Dual Graphite-Gated BLG As Platform for Cryogenic FETs


A technical paper titled “Ultra-steep slope cryogenic FETs based on bilayer graphene” was published by researchers at RWTH Aachen University, Forschungszentrum Julich, National Institute for Materials Science (Japan), and AMO GmbH. "Here, we show that FETs based on Bernal stacked bilayer graphene encapsulated in hexagonal boron nitride and graphite gates exhibit inverse subthreshold slop... » read more

Flexible-Wafer Platform And CMOS-Compatible 300mm Wafer-Scale Integrated-Photonics Fabrication


A new technical paper titled "Mechanically-flexible wafer-scale integrated-photonics fabrication platform" was published by researchers at MIT and New York Center for Research, Economic Advancement, Technology, Engineering, and Science (NY CREATES). Abstract "The field of integrated photonics has advanced rapidly due to wafer-scale fabrication, with integrated-photonics platforms and fabric... » read more

Heterogeneity Of 3DICs As A Security Vulnerability


A new technical paper titled "Harnessing Heterogeneity for Targeted Attacks on 3-D ICs" was published by Drexel University. Abstract "As 3-D integrated circuits (ICs) increasingly pervade the microelectronics industry, the integration of heterogeneous components presents a unique challenge from a security perspective. To this end, an attack on a victim die of a multi-tiered heterogeneous 3-... » read more

A Hybrid ECO Detailed Placement Flow for Mitigating Dynamic IR Drop (UC San Diego)


A new technical paper titled "A Hybrid ECO Detailed Placement Flow for Improved Reduction of Dynamic IR Drop" was published by researchers at UC San Diego. Abstract: "With advanced semiconductor technology progressing well into sub-7nm scale, voltage drop has become an increasingly challenging issue. As a result, there has been extensive research focused on predicting and mitigating dynam... » read more

Classification and Localization of Semiconductor Defect Classes in Aggressive Pitches (imec, Screen)


A new technical paper titled "An Evaluation of Continual Learning for Advanced Node Semiconductor Defect Inspection" was published by Imec and SCREEN SPE Germany. Abstract "Deep learning-based semiconductor defect inspection has gained traction in recent years, offering a powerful and versatile approach that provides high accuracy, adaptability, and efficiency in detecting and classifying... » read more

Survey of Energy Efficient PIM Processors


A new technical paper titled "Survey of Deep Learning Accelerators for Edge and Emerging Computing" was published by researchers at University of Dayton and the Air Force Research Laboratory. Abstract "The unprecedented progress in artificial intelligence (AI), particularly in deep learning algorithms with ubiquitous internet connected smart devices, has created a high demand for AI compu... » read more

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