Author's Latest Posts

Role of Josephson Junctions In Propelling Quantum Technologies Forward (LBNL, UC Berkeley, et al.)
By Technical Paper Link - 31 May, 2025 - Comments: 0

A new technical paper titled "Josephson Junctions in the Age of Quantum Discovery" was published by researchers at Lawrence Berkeley National Laboratory, UC Berkeley, Gwangju Institute of Science and Technology, Korea University, Max Planck and Anyon Computing. Abstract "The unique combination of energy conservation and nonlinear behavior exhibited by Josephson junctions has driven transfor... » read more

Doping Mechanism Of Pure Nitric Oxide In Tungsten Diselenide Transistors (Purdue, MIT, NYCU)
By Technical Paper Link - 22 May, 2025 - Comments: 0

A technical paper titled "Uncovering the doping mechanism of nitric oxide in high-performance P-type WSe2 transistors" was published by researchers at Purdue University, MIT and National Yang Ming Chiao Tung University (with support from Intel Corporation). "Atomically thin two-dimensional (2D) semiconductors are promising candidates for beyond-silicon electronic devices. However, an excessi... » read more

Optimization Approach For The Dispensing of Thermal Interface Material (KIT, Robert Bosch)
By Technical Paper Link - 21 May, 2025 - Comments: 0

A new technical paper titled "TIMtrace: Coverage Path Planning for Thermal Interface Materials" was published by researchers at Karlsruhe Institute of Technology (KIT) and Robert Bosch GmbH. Abstract "Thermal Interface Materials are used to transfer heat from a semiconductor to a heatsink. They are applied along a dispense path onto the semiconductor and spread over its entire surface once ... » read more

Transformation Of 2D-ICs Into 3D-ICs Using Shuttle Chips From Multi-Project Wafers (Tohoku University)
By Technical Paper Link - 20 May, 2025 - Comments: 0

A new technical paper titled "Die-Level Transformation of 2D Shuttle Chips into 3D-IC for Advanced Rapid Prototyping using Meta Bonding" was published by researchers at Tohoku University. Abstract "Three-dimensional integrated circuit (3D-IC) technology, often referred to as through-silicon via (TSV) formation technology, has been steadily maturing and is increasingly used in advanced semic... » read more

Overview Of 103 Research Papers On Automatic SEM Image Analysis Algorithms For Semiconductor Defect Inspection (KU Leuven, Imec)
By Technical Paper Link - 20 May, 2025 - Comments: 0

A new technical paper titled "Scanning electron microscopy-based automatic defect inspection for semiconductor manufacturing: a systematic review" was published by researchers at KU Leuven and imec. "We identified, categorized, and discussed automatic defect inspection algorithms that analyze scanning electron microscopy (SEM) images for semiconductor manufacturing (SM). This is a topic of c... » read more

Open-Source And Royalty-Free Confidential Computing For Embedded RISC-V Systems (IBM, Max Planck)
By Technical Paper Link - 20 May, 2025 - Comments: 0

A new technical paper titled "ACE: Confidential Computing for Embedded RISC-V Systems" was published by researchers at IBM Research, IBM T.J. Watson Research Center, Max Planck Institute for Software Systems (MPI-SWS). Abstract "Confidential computing plays an important role in isolating sensitive applications from the vast amount of untrusted code commonly found in the modern cloud. We a... » read more

Energy-Aware DL: The Interplay Between NN Efficiency And Hardware Constraints (Imperial College London, Cambridge)
By Technical Paper Link - 20 May, 2025 - Comments: 0

A new technical paper titled "Energy-Aware Deep Learning on Resource-Constrained Hardware" was published by researchers at Imperial College London and University of Cambridge. Abstract "The use of deep learning (DL) on Internet of Things (IoT) and mobile devices offers numerous advantages over cloud-based processing. However, such devices face substantial energy constraints to prolong batte... » read more

Air-Gap Covert Channel Attack On Spread Spectrum Modulated Clocks (IETR, Lab-STICC)
By Technical Paper Link - 20 May, 2025 - Comments: 0

A new technical paper titled "Clock-to-Clock Modulation Covert Channel" was published by researchers at University of Rennes-INSA Rennes-IETR-UMR  and University of South Brittany/Lab-STICC- UMR CNRS. Abstract "Various Electromagnetic (EM) attacks have been developed to modulate and utilize EM emanations for covert communication, including exploiting processors, memory modules, and periphe... » read more

Cache Side-Channel Attacks On LLMs (MITRE, WPI)
By Technical Paper Link - 18 May, 2025 - Comments: 0

A new technical paper titled "Spill The Beans: Exploiting CPU Cache Side-Channels to Leak Tokens from Large Language Models" was published by researchers at MITRE and Worcester Polytechnic Institute. Abstract "Side-channel attacks on shared hardware resources increasingly threaten confidentiality, especially with the rise of Large Language Models (LLMs). In this work, we introduce Spill The... » read more

Demonstration Of EUV Scatterometry On A 2D Periodic Interconnect
By Technical Paper Link - 18 May, 2025 - Comments: 0

A new technical paper titled "Coherent EUV scatterometry of 2D periodic structure profiles with mathematically optimal experimental design" was published by researchers at University of Colorado, NIST, Samsung and KMLAbs. Abstract "Extreme ultraviolet (EUV) scatterometry is an increasingly important metrology that can measure critical parameters of periodic nanostructured materials in a fas... » read more

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