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Benefits Of Memory-Centric Computing (ETH Zurich)
By Technical Paper Link - 06 May, 2025 - Comments: 0

A new technical paper titled "Memory-Centric Computing: Solving Computing's Memory Problem" was published by researchers at ETH Zurich. Abstract "Computing has a huge memory problem. The memory system, consisting of multiple technologies at different levels, is responsible for most of the energy consumption, performance bottlenecks, robustness problems, monetary cost, and hardware real esta... » read more

Main Applications And Corresponding Requirements For IMC With RRAM Devices
By Technical Paper Link - 06 May, 2025 - Comments: 0

A new technical paper titled "Resistive Switching Random-Access Memory (RRAM): Applications and Requirements for Memory and Computing" was published by researchers at Politecnico di Milano, IUNET and Hewlett-Packard Labs. Abstract "In the information age, novel hardware solutions are urgently needed to efficiently store and process increasing amounts of data. In this scenario, memory device... » read more

A Route For More Efficient SOT-MRAM Designs (NTU, TSMC)
By Technical Paper Link - 06 May, 2025 - Comments: 0

A new technical paper titled "Efficient Magnetization Switching via Orbital-to-Spin Conversion in Cr/W-Based Heterostructures" by researchers at National Taiwan University and TSMC. Abstract "A highly efficient spin–orbit torque (SOT) switching mechanism is crucial for the realization of practical SOT magnetic random-access memory (MRAM). This study proposes a Cr/W-based spin current sour... » read more

Real-time Electrostatic Discharge (ESD) Monitoring Detector For Semiconductor Manufacturing
By Technical Paper Link - 05 May, 2025 - Comments: 0

A new technical paper titled "Real-Time ESD Monitoring and Control in Semiconductor Manufacturing Environments With Silicon Chip of ESD Event Detection" was published by researchers at National Yang Ming Chiao Tung University. Abstract "Integrated circuits are susceptible to electrostatic discharge (ESD) events. Real-time detection and alerting of ESD events in semiconductor manufacturing e... » read more

Investigation Of Self-Heating Effects on Fe-FinFETs On IMC Applications (TU Munich, IIT, U. Stuttgart)
By Technical Paper Link - 04 May, 2025 - Comments: 0

A new technical paper titled "Investigating Self-Heating Effects in Ferroelectric FinFETs for Reliable In-Memory Computing" was published by researchers at TU Munich, University of Stuttgart and Indian Institute of Technology, Kanpur. Abstract "Ferroelectric (Fe) FET has emerged as a promising candidate for efficient in-memory computing due to its properties, such as non-volatility and lo... » read more

Hardware Trojan Attack For SNNs (Sorbonne Université, CNRS)
By Technical Paper Link - 03 May, 2025 - Comments: 0

A new technical paper titled "Input-Triggered Hardware Trojan Attack on Spiking Neural Networks" was published by researchers at Sorbonne Universite, CNRS and Queen’s University Belfast. Abstract "Neuromorphic computing based on spiking neural networks (SNNs) is emerging as a promising alternative to traditional artificial neural networks (ANNs), offering unique advantages in terms of low... » read more

Inference Framework For Deployment Challenges of Large Generative Models On GPUs (Google)
By Technical Paper Link - 03 May, 2025 - Comments: 0

A new technical paper titled "Scaling On-Device GPU Inference for Large Generative Models" was published by researchers at Google and Meta Platforms. Abstract "Driven by the advancements in generative AI, large machine learning models have revolutionized domains such as image processing, audio synthesis, and speech recognition. While server-based deployments remain the locus of peak perform... » read more

Optimizing End-to-End Communication And Workload Partitioning In MCM Accelerators (Georgia Tech)
By Technical Paper Link - 03 May, 2025 - Comments: 0

A new technical paper titled "MCMComm: Hardware-Software Co-Optimization for End-to-End Communication in Multi-Chip-Modules" was published by researchers at Georgia Tech. Abstract "Increasing AI computing demands and slowing transistor scaling have led to the advent of Multi-Chip-Module (MCMs) based accelerators. MCMs enable cost-effective scalability, higher yield, and modular reuse by par... » read more

Automotive Security Risks Associated With Wireless Communication
By Technical Paper Link - 01 May, 2025 - Comments: 0

A new technical paper titled "Revisiting Wireless Cyberattacks on Vehicles" was published by researchers at Comillas Pontifical University and MIT. Abstract "The automotive industry has been a prime target for cybercriminals for decades, with attacks becoming more sophisticated as vehicles integrate advanced digital technologies. In response, new standards and regulations have been introduc... » read more

Inter-Chiplet Interconnect Topologies On Organic And Glass Substrates
By Technical Paper Link - 29 Apr, 2025 - Comments: 0

A new technical paper titled "FoldedHexaTorus: An Inter-Chiplet Interconnect Topology for Chiplet-based Systems using Organic and Glass Substrates" was published by researchers at ETH Zurich. Abstract "Chiplet-based systems are rapidly gaining traction in the market. Two packaging options for such systems are the established organic substrates and the emerging glass substrates. These substr... » read more

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