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NIST Releases “Vision And Strategy for the National Semiconductor Technology Center”
By Technical Paper Link - 05 May, 2023 - Comments: 0

A paper titled "A Vision and Strategy for the National Semiconductor Technology Center" was published by the U.S. Department of Commerce’s National Institute of Standards and Technology (NIST). The paper describes how the NSTC (National Semiconductor Technology Center) will develop and safeguard chips and technologies of the future. “The NSTC will be an ambitious public-private consortiu... » read more

Gate Drive Circuit Without A Speed-Up Capacitor for a GaN Gate Injection Transistor
By Technical Paper Link - 05 May, 2023 - Comments: 0

A technical paper titled "Gate Drive Circuit Suitable for a GaN Gate Injection Transistor" was published by researchers at Nagoya University. Abstract "A GaN gate injection transistor (GIT) has great potential as a power semiconductor device. However, a GaN GIT has a diode characteristic at the gate-source, and a corresponding gate drive circuit is thus required. Several studies in the lite... » read more

Ethernet-Based In-Car Networking and Trends in Automotive Communications
By Technical Paper Link - 05 May, 2023 - Comments: 0

A technical paper titled "A Perspective on Ethernet in Automotive Communications—Current Status and Future Trends" was published by researchers at University of Catania. Abstract "Automated driving requires correct perception of the surrounding environment in any driving condition. To achieve this result, not only are many more sensors than in current Advanced Driver Assistant Systems (AD... » read more

New Low-Temp Growth & Fabrication Technology Allowing Integration of 2D Materials Directly Onto A Silicon Circuit (MIT)
By Technical Paper Link - 05 May, 2023 - Comments: 0

A new technical paper titled "Low-thermal-budget synthesis of monolayer molybdenum disulfide for silicon back-end-of-line integration on a 200 mm platform" was published by researchers at MIT, Oak Ridge National Laboratory, and Ericsson Research. According to this MIT news article: "Growing 2D materials directly onto a silicon CMOS wafer has posed a major challenge because the process u... » read more

Split Additive Manufacturing for Printed Neuromorphic Circuits (Karlsruhe Institute of Technology)
By Technical Paper Link - 05 May, 2023 - Comments: 0

A new technical paper titled "Split Additive Manufacturing for Printed Neuromorphic Circuits" was published by researchers at Karlsruher Institut für Technologie (KIT). Abstract: "Printed and flexible electronics promises smart devices for application domains, such as smart fast moving consumer goods and medical wearables, which are generally untouchable by conventional rigid silicon tech... » read more

Attestation Scheme Monitoring The Prover Using Hardware Security Module Connected To Its System Bus (Oxford)
By Technical Paper Link - 05 May, 2023 - Comments: 0

A technical paper titled "Hardware-assisted remote attestation design for critical embedded systems" was published by researchers at University of Oxford. Abstract (excerpt) "To reveal attack scenarios exploiting the memory regions and time windows left unattested, we propose an attestation scheme that can continuously monitor both static and dynamic memory regions with better spatial and t... » read more

ML-Based Third-Party IP Trust Verification Framework (U. of Florida, U. of Kansas)
By Technical Paper Link - 01 May, 2023 - Comments: 0

A technical paper titled "Hardware IP Assurance against Trojan Attacks with Machine Learning and Post-processing" was published by researchers at University of Florida and University of Kansas. Abstract: "System-on-chip (SoC) developers increasingly rely on pre-verified hardware intellectual property (IP) blocks often acquired from untrusted third-party vendors. These IPs might contain hidd... » read more

GaN Power Devices: Stability, Reliability and Robustness Issues
By Technical Paper Link - 30 Apr, 2023 - Comments: 0

A technical paper titled "Stability, Reliability, and Robustness of GaN Power Devices: A Review" was published by researchers at Virginia Polytechnic Institute and State University, Johns Hopkins University Applied Physics Laboratory, and Kyushu University. "Gallium nitride (GaN) devices are revolutionarily advancing the efficiency, frequency, and form factor of power electronics. However, t... » read more

EPFL’s Open Source Single-Core RISC-V Microcontroller for Edge Computing
By Technical Paper Link - 30 Apr, 2023 - Comments: 0

A new technical paper titled "X-HEEP: An Open-Source, Configurable and Extendible RISC-V Microcontroller" was published by researchers at Ecole Polytechnique Fédérale de Lausanne (EPFL). Abstract: "In this work, we present eXtendible Heterogeneous Energy-Efficient Platform (X-HEEP), a configurable and extendible single-core RISC-V-based ultra-low-power microcontroller. X-HEEP can be used ... » read more

Using The Schottky Barrier Transistor in Various Applications & Material Systems
By Technical Paper Link - 30 Apr, 2023 - Comments: 0

A new technical review paper titled "The Schottky barrier transistor in emerging electronic devices" was published by researchers at THM University of Applied Sciences, Chalmers University of Technology, CNRS, University Grenoble Alpes and others. Abstract "This paper explores how the Schottky barrier (SB) transistor is used in a variety of applications and material systems. A discussion of... » read more

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