Blog Review: Aug. 22

EUV at 5nm; data packing in embedded; security testing; 56G.


Cadence’s Paul McLellan considers how much further we need to go to make EUV work for 5nm, the problem of cost, and ASML’s EUV roadmap.

In a video, Mentor’s Colin Walls explains optimizing data in embedded software with a simple example of two ways to put data in memory and how to decide which is best.

Synopsys’ Fred Bals provides a rundown of the different types of application security testing practices, the circumstances under which they work best, and what to look for when choosing tools.

Intel’s Ron Wilson examines what goes on inside 56G PAM4 transceivers and how the new serial communications technology deals with attenuation, inter-symbol interference, and reflections.

Ansys’ Annapoorna Krishnaswamy argues that for new mobile devices to meet their power budgets and release schedules, it’s increasingly important to address power early in the design with efficient RTL.

Arm’s Louise Paul introduces using CMSIS-NN, a neural network library optimized for Cortex-M microcontrollers, on the OpenMV serial camera.

A Rambus writer checks out a new report from Bain and Company, which finds that while the IoT markets is expected to grow to about $520 billion in 2021, many companies are are planning less extensive IoT implementations than they were a few years ago.

ON Semiconductor’s John Grabowski takes a look at new approaches to battery disconnect in electric vehicles that aim for extremely low leakage to prevent discharge and potentially dangerous situations when the car is parked.

Nvidia’s Scott Martin notes that railway firms are turning to digital twins to model performance of trains and rail networks to keep people and goods moving on schedule.

SEMI’s Cristina Sandoval points to a new program if you’re interested in helping young professionals and students in the industry develop their careers – or if you’re seeking mentorship yourself.

And don’t miss the blogs featured in last week’s Manufacturing & Process Technology newsletter:

Editor in Chief Ed Sperling argues that import/export duties are only part of the picture, and what you can’t see can still hurt.

Executive Editor Mark LaPedus shines a spotlight on 3D memory, FeFETs, MRAM and ReRAM.

GlobalFoundries’ Peter Rabbeni contends that 5G is necessary to deal with an increasing volume of data, but notes that millimeter wave will require a wave of new technologies.

Semico Research’s Jim Feldhan predicts that by 2023 more than 90% of vehicles produced will be connected, adding a range of features.

Lam Research’s Kris Kendall notes that the cost contribution of electronics in new cars has reached 45%.

SEMI blogger Julian West observes that the number of vacuum process steps will increase with multi-patterning and 3D NAND.

Applied Materials’ Jonathan Bakke looks at what comes after tungsten fill for contacts and copper for the lowest-level interconnects.

Coventor’s Michael Hargrove explains using process simulation to design silicon photonics devices.

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