Blog Review: Jan. 18

Skipping nodes; MIPI I3C; security and RISC-V; contact resistance; packaging; CES; changes in flash storage.


Mentor’s Michael White warns that while skipping a node can be appealing, be prepared for the increase in computation requirements.

Synopsys’ Hezi Saar checks out the benefits of moving to the MIPI I3C standardized sensor interface.

Cadence’s Paul McLellan highlights a talk by Eric Grosse on approaches to security and the RISC-V architecture.

Applied’s Mike Chudzik explains the problems with increased contact resistance at shrinking nodes, and replacement materials to ease the issue.

A Lam Research staff writer provides a primer on strategies for next-generation advanced packaging.

Semico’s Jim Feldhan shares highlights from the automotive side of CES, plus an update from GlobalFoundries.

Samsung’s Jim Elliott looks at the most pivotal changes in flash storage over the past year.

Rambus’ Aharon Etengoff says to expect mobile proximity payments to keep on growing, reaching $92 billion by 2019.

Ansys’ Thierry Marchal checks out how simulation is being used in the medical field.

ARM’s Soshun Arai introduces a partnership with Renault and OSVehicle to open up vehicle information from the CAN network to developers building new ADAS or infotainment systems.

NXP’s Birgit Ahlborn shares five automotive advances the company showed off at CES.

Cadence’s Scott Jacobson tracks the evolution of Ethernet, beginning with what the world looked like before Ethernet and other networking standards came about.

USB was plentiful at CES this year, says Synopsys’ Michael Posner.

Mentor’s Andrew Patterson argues it will be important for consumer electronics to connect seamlessly with in-vehicle systems.

And don’t forget the blogs featured in last week’s Low Power-High Performance newsletter:

Editor In Chief Ed Sperling examines how bureaucracy can mess up the semiconductor supply chain.

Executive Editor Ann Steffora Mutschler points to neural networking as the rising star in computer science, with some caveats.

Synopsys’ Marc Greenberg observes that DRAM is moving beyond infotainment into safety-critical applications.

Rambus’ Jeff Kaady calls out the most important elements in SerDes design.

Ansys’ Youngsoo Lee contends that chip-package-system co-design helps produce more cost-effective and reliable chips.

Mentor Graphics’ Russell Klein compares tackling a bug to catching a jewel thief.

Cadence’s Tom Anderson argues that even without a UPF file, having a portable stimulus model saves time and effort.

ARM’s Prithi Ramakrishnan looks at how evolving standards enable new generations of applications.

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