Blog Review: Jan. 27

Synopsys’ Godwin Maben finds that applications like high-performance computing and AI are bringing new dynamics to the power equation, and the key power considerations for chip design that will likely emerge over the course of the year.

Siemens EDA’s Harry Foster checks out trends in verification technology adoption for IC and ASIC design, with increasing numbers of designs using both dynamic and static verification techniques, with particularly fast growth for automatic formal applications.

Cadence’s Paul McLellan predicts what Intel might do in the coming year as shareholders pressure changes, plus whether a marketplace for chiplets will emerge.

In a blog for Arm, Samuel C. B. Wong of University of Southampton explores how to design efficient energy scavenging systems for deeply embedded or remote sensors and IoT devices.

Ansys’ Theresa Duncan and Michael Blattau explain how to use PCB modeling and simulation to identify and optimize for the major causes of electronic failure, including vibration, shock, and temperature cycling.

A Rambus writer checks out the most significant advances in DDR5, such as higher bandwidth, lower voltage, and new power and channel architectures, plus some new design challenges including special attention on signal integrity.

SEMI’s Serena Brischetto chats with Franz Laermer of Robert Bosch GmbH Stuttgart about trends in medical diagnostics and the microfluidics technologies and microelectronics that could make personalized treatments possible.

And don’t miss the blogs featured in the latest Manufacturing, Packaging & Materials newsletter:

Executive Editor Mark LaPedus’s conversation with industry analysts reveals a bright outlook for 2021, along with some challenges.

Amkor’s Prasad Dhond examines the key sensors and components that enable the latest automotive safety features.

Coventor’s Jeonghoon Kim demonstrates how virtual process libraries can accelerate semiconductor process development.

Brewer Science’s Darin Collins and Jessica Albright lay out three approaches that work in tandem for improved materials characterization.

SEMI’s Serena Brischetto speaks with EV Group’s Elisabeth Brandl about how the power electronics industry is transitioning from silicon to wide bandgap compound semiconductor materials such as silicon carbide and gallium nitride.