Blog Review: Jan. 31

Synopsys’ William Ruby argues for a comprehensive energy-efficient design methodology for automotive ICs as today’s vehicles demand ever more computing power to support electrification, communication, and processing of massive amounts of data.

Cadence’s Mellacheruvu Srikanth finds that verifying all the new features and enhancements across several generations of PCIe while maintaining backward compatibility requires advanced system-level verification and identifies several challenging areas.

Siemens’ John McMillan notes that broad industry proliferation of heterogeneous integration will require the standardization of chiplet models along with the die-to-die connectivity IP, along with workflows that support die package codesign.

Ansys’ Pavani Gottipati explains key considerations in designing permanent magnet latching mechanisms for electronics and how sizing and material studies can help optimize the force in latching mechanisms while reducing the cost.

Infineon’s Ella Rickerson dives into the complexities of developing a gesture recognition system and how such complexities can be significantly simplified by leveraging specialized machine learning platforms.

Arm’s Richard Grisenthwaite anticipates that existing foundational security technologies and standards will be more important than ever in the age of AI and highlights several security approaches used in the Armv9 architecture.

Keysight’s Jonathon Wright suggests that domain-specialized generative AI can play a role in augmenting and further automating software testing.

SEMI’s Natasha Hodas and Elena Kocherovsky introduce guidelines for companies in the semiconductor value chain on tracking and reporting greenhouse gas emissions related to purchased goods and services, also referred to as Scope 3 Category 1 emissions.

Plus, check out the blogs featured in the latest Systems & Design newsletter:

Technology Editor Brian Bailey looks at the Synopsys/Ansys announcement and questions whether the financial people rushing toward EDA are missing the point.

Siemens EDA’s Matthew Walsh and Matt Bromley explain how to provide a seamless flow of data across various product lifecycle stages, domains, and disciplines.

Arteris’ Frank Schirrmeister finds that a decade on from big expectations, AR/VR still holds potential.

Synopsys’ Dermott Lynch points to applications like EVs, renewable energy, and cloud computing as the big drivers for increased efficiency and power density.

Movellus’ Barry Pangrle zeroes in on TSMC’s node-shrinking progress.

Keysight’s Emily Yan shows how the standardization of IP tracking helps ensure reliability and seamless interaction between multiple IPs in an application-specific way.

Cadence’s Mark Seymour contends that running data centers at higher temperatures can provide energy savings and reduced operational costs.