Blog Review: July 6

Neural networks; IoT chips; interconnect robustness; business algorithms; helium; e-beam 101.


Cadence’s Chris Rowen discusses optimizing neural networks for low-energy and high-throughput applications in his latest video.

What should you include in an IoT chip? Synopsys’ Eric Huang presents the case for building in USB.

Mentor’s Matthew Hogan takes a look at what’s needed for speedy interconnect robustness verification.

Rambus’ Aharon Etengoff digs into a potential new enterprise trend: algorithmic business models.

Research into implanting false memories makes stories like Total Recall seem not just science fiction, in this week’s top five tech picks from Ansys’ Bill Vandermark. Plus, a new place to build rockets and how the helium shortage may just have been hot air.

Applied’s Ralf Schmid presents a video primer on the basics of e-beam technology.

ARM’s Freddi Jeffries takes a look at the changes in the new Bifrost architecture powering the company’s future GPUs.

NXP’s Charles Dachs examines the explosion of public transportation in China.

And if you missed last week’s System-Level Design newsletter, check out these featured blogs:

Editor In Chief Ed Sperling argues that the focus has shifted to what can be done with computing, opening up a whole new set of problems.

Synopsys’s Tom De Schutter observes that from cars to tools, it’s important to know your customers are happy.

OneSpin’s Dave Kelf looks at how to handle timed assertions with formal apps.

Cadence’s Frank Schirrmeister recounts a customer’s story of reducing the bring-up time of their first software release.

Aldec’s Henry Chan digs into how to keep a neat repository for a flexible testbench structure.

eSilicon’s Mike Gianfagna finds a growing interest in moving away from batteries.

NetSpeed’s Rajesh Ramanujam highlights what you need to worry about with interconnects.

ARM’s Matt Sealey offers a hands-on approach for embedded C/C++ tools.

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