Blog Review: Mar. 27

Cadence’s Steve Brown suggests that multi-die technologies will be a key part of the path toward a faster, more efficient chip ecosystem that can support the compressed development cycles now emerging in the automotive industry.

Synopsys’ John Swanson, Madhumita Sanyal, and Priyank Shukla point to the role of simulation in ensuring seamless operation in the Ethernet ecosystem though rigorous evaluations to determine device interoperability.

Siemens’ Stephen V. Chavez highlights several key considerations in rigid flex PCB design, including ensuring proper mechanical reliability, managing signal integrity, and using a design for manufacturability methodology.

Arm’s Stephen Su considers how several features of transformer networks such as a parallelizable architecture, improved performance of smaller models thanks to the self-attention mechanism, and advancements in model-compression techniques are enabling more sophisticated models to be run on more resource-constrained devices at the edge.

Ansys’ Laura Carter checks out how the UK Atomic Energy Authority uses simulation to develop physical test rigs designed to test meter-scale prototype components of fusion reactors in an environment representative of a fusion power plant, such as being placed next to 100 million to 200 million degree plasma.

Keysight’s Choon-Hin Chang finds that USB power sensors can improve the convenience and cost-effectiveness of power tests by turning any computer or compatible instrument into accurate power meters.

The ESD Alliance’s Bob Smith chats with John Lee of Ansys about the importance of cultivating the team culture within the organization and why continual learning is necessary for leadership.

Plus, check out the blogs featured in the latest Manufacturing, Packaging & Materials newsletter:

Amkor’s Sanghyuk Kim takes a deep dive into cooling enhancements and why they are moving closer to silicon than ever before.

Synopsys’ Gandharv Bhatara stresses the importance of accurate modeling of aberrations, compact 3D mask modeling, and expanding inverse lithography to full-chip processing.

SEMI’s Bob Smith looks at how one company tackled unlicensed use of its software.