Blog Review: March 22

Cadence’s Paul McLellan shares TSMC’s plans for 5nm and gate-all-around FET, plus other highlights from last week’s Technology Symposium.

Mentor’s Craig Armenti examines how product development teams can increase efficiency through concurrent schematic design.

Synopsys’ Jim Ivers warns of the data security and privacy issues posed by a wave of popular connected toys.

At Embedded World, ARM’s Eoin McCann finds that the classic definition of embedded computing needs to be updated as the industry expands into new areas.

Rambus’ Aharon Etengoff points out a new side-channel attack that bypasses address space layout randomization and how it works.

A National Instruments staff writer shares highlights of the Embedded World show floor, from an array of autos to how the embedded industry is adapting to the IIoT.

While 10 Gbps Ethernet is a common feature in data centers, Intel’s Ron Wilson observes that it’s also appearing in architectural plans for next-generation embedded systems.

A Lam Research staff writer points to a proliferation of wearables that seek to improve lives by ditching the screen.

Ansys’ Sudhir Sharma suggests engineering simulation as a way to utilize the vast amounts of data generated by connected devices.

NXP’s Joseph Byrne considers how industrial enterprises are combining their computer and shop-floor automation domains and the role of time-sensitive network technology.

In a video, Cadence’s Alex Passi takes a closer look at Display Stream Compression and how it is used over the MIPI DSI protocol to deliver higher display resolutions to mobile devices over slower transport layers.

Synopsys’ Richard Solomon gets a personal look at the real-world culmination of PCIe advances with his new 2-in-1.

And don’t forget the blogs featured in last week’s Manufacturing & Process Technology newsletter:

Editor In Chief Ed Sperling contends that as more options open for manufacturing, so do questions about investments.

Executive Editor Mark LaPedus talks with experts from Applied Materials, ASML and Lam Research about the future of patterning.

Technical Editor Katherine Derbyshire explains that what technology gets used in the future will depend on power requirements.

Semico Research’s Jim Feldhan examines what is driving improved sales and whether this is sustainable.

Applied Materials’ Mike Rosa points to an emerging class of MEMS devices, including fingerprint sensors and MEMS-based LIDAR.

Coventor’s Jun Yan argues that taking advantage of the growing market for MEMS microphones requires careful consideration of device multiphysics and system integration.