Week In Review: Manufacturing, Test


Chipmakers and OEMs Delphi Technologies is in volume production with a 800 volt silicon carbide (SiC) inverter for next-generation electric and hybrid vehicles. The inverter extends electric vehicle (EV) ranges. It also halves the charging times compared with today's 400 volt systems. In a separate announcement, Delphi Technologies and Cree have announce a partnership to utilize SiC semicon... » read more

Test On New Technology’s Frontiers


Semiconductor testing is getting more complicated, more time-consuming, and increasingly it requires new approaches that have not been fully proven because the technologies they are addressing are so new. Several significant shifts are underway that make achieving full test coverage much more difficult and confidence in the outcome less certain. Among them: Devices are more connected an... » read more

Looking To Unlicensed Spectrum For 5G


When the International Telecom Union (ITU) outlined the key objectives for 5G, the 3GPP faced the difficult task of expanding the capabilities of the current wireless network under the constraint of limited spectrum. Spectrum equates to bandwidth, and the industry needs more spectrum to increase data rates and address specific use cases beyond 4G. Unfortunately, there isn’t much unoccupied sp... » read more

Under The Hood Of NI Linux Real-Time


The NI LabVIEW Real-Time Module supports the NI Linux Real-Time OS, available on select NI hardware. In this article, learn about specific new features and advanced topics to get the most out of NI Linux Real-Time for your application. To read more, click here. » read more

Week In Review: Manufacturing, Test


China's DRAM efforts Two memory vendors from China, Tsinghua Unigroup and ChangXin Memory Technology, have disclosed more details about their respective efforts to enter the DRAM arena. As reported, Tsinghua Unigroup wants to enter the DRAM business. Now, the China-based firm has secured land to build a new DRAM fab. The firm recently signed an agreement with the Chongqing government to e... » read more

Autonomous Vehicles Are Reshaping The Tech World


The effort to build cars that can drive themselves is reshaping the automotive industry and its supply chain, impacting everything from who defines safety to how to ensure quality and reliability. Automakers, which hardly knew the names of their silicon suppliers a couple of years ago, are now banding together in small groups to share the costs and solve technical challenges that are well be... » read more

On The Cusp Of 5G


Carriers and chipmakers are celebrating the rollout of the first standards-compliant commercial 5G services. "We are, officially in the era of 5G," said John Smee, vice president of engineering at Qualcomm at the recent 5G Summit at IEEE's International Microwave Symposium (IMS) in Boston. Movement is happening on the commercial end. Major U.S. carriers Verizon, AT&T and Sprint have set ... » read more

Week In Review: Manufacturing, Test


Fab tools Lam Research has rolled out two new tools for use in the production of 3D NAND. The first tool, called the VECTOR DT, is geared for backside deposition. The second system, the EOS GS, is a wet etch tool for film removal on backside and bevel. Designed to control the wafer bow in 3D NAND manufacturing, the VECTOR DT system is the latest addition to Lam’s plasma-enhanced chemical ... » read more

How Many Test Miles Make A Vehicle Safe?


The road to reliable safety testing of autonomous vehicles (AVs) is shifting left. Standards groups are beginning to publish functional safety standards that could make it possible to verify what a machine-learning AV pilot application will do in a traffic situation even before hardware or software is released from validation testing. This kind of approach has been possible for some time in ... » read more

Using Better Data To Shorten Test Time


The combination of machine learning plus more sensors embedded into IC manufacturing equipment is creating new possibilities for more targeted testing and faster throughput for fabs and OSATs. The goal is to improve quality and reduce the cost of manufacturing complex chips, where time spent in manufacturing is ballooning at the most advanced nodes. As the number of transistors on a die incr... » read more

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