Chasing Reliability In Automotive Electronics


Assuring reliability in automotive electronics has set off a scramble across the semiconductor supply chain and unearthed a list of issues for which there is insufficient data, a lack of well-defined standards, and inconsistent levels of expertise. Reliable functional safety that spans 18 to 20 years of service in harsh environments, or under constant use with autonomous taxis or trucks, is ... » read more

Using a Fault Insertion and Current Sensing Unit


When testing embedded software on mission critical electronic control units, like those used in automobiles or aircraft, it is important to validate the behavior with external faults for example if the integrity of the signals to the controller are compromised. The SLSC-12251/2 products from NI are designed for this purpose, these modules can be inserted into the signal path between the data ac... » read more

Peak Signal-To-Noise Ratio As An Image Quality Metric


The term peak signal-to-noise ratio (PSNR) is an expression for the ratio between the maximum possible value (power) of a signal and the power of distorting noise that affects the quality of its representation. Because many signals have a very wide dynamic range, (ratio between the largest and smallest possible values of a changeable quantity) the PSNR is usually expressed in terms of the logar... » read more

The Growing Promise Of Printed Electronics


Printing electronics using conductive ink rather than lithography is starting to move out of the research phase, with chipmakers now looking at how to commercialize this technology across a broad range of sensor applications. Unlike traditional semiconductors, which use tiny wires as circuits, printed electronics rely on conductive inks and often flexible films, although they can be printed ... » read more

Week In Review: Manufacturing, Test


Chipmakers GlobalFoundries has announced that its advanced silicon-germanium (SiGe) offering is available for prototyping on 300mm wafers. GF’s SiGe technology has been shipping on its 200mm production line in Burlington, Vt. The technology, a 90nm SiGe process, is moving to 300mm wafers at GF’s Fab 10 facility in East Fishkill, N.Y. The SiGe technology is called 9HP. “The increasing ... » read more

Week in Review: IoT, Security, Auto


Internet of Things Lowe’s, the home improvement retailer, is giving up on the smart home market. The company is putting its Iris Smart Home business up for sale as part of a reorganization. The retailer made a big splash at CES 2015 with its Innovation Lab offerings, which included retail service robots and the Holoroom “home improvement simulator.” The Iris product line includes multipl... » read more

Testing Millimeter Wave for 5G


By Susan Rambo and Ed Sperling The telecommunications world is hurtling toward 5G, but there is no consistency about how this next-gen wireless technology will be rolled out across various regions and plenty of unknowns about how it will be tested and how reliable it will be initially. A fair amount of confusion exists around what 5G constitutes in the first place. There is sub-6GHz 5G, w... » read more

Design, System Integration and Testing of Radar Systems


This article discusses some of the fundamental research and development challenges in both the digital and RF/millimeter wave domains (such as waveform generation, receiver algorithms and transmit/receive front ends) and addresses current and future directions in design, system integration and test. Radar applications are becoming more diverse and commercialization is accelerating due to sig... » read more

Blog Review: Oct. 31


Mentor's Joe Hupcey III digs into handling memories effectively with formal through abstraction and the easiest ways to address memory-related inconclusive results. Cadence's Paul McLellan explains DARPA's CHIPS program that aims to lower semiconductor design costs through chiplet-based designs, the current status of the work, and what the next steps will be. Synopsys' Sangeeta Kulkarni c... » read more

Week In Review: Manufacturing, Test


Chipmakers GlobalFoundries and the Chengdu municipality have signed an amendment and changed the strategy of their joint fab investment in Chengdu, China. Originally, GlobalFoundries was supposed to install 180nm/130nm processes in the China-based 300mm fab. The partners have decided to bypass that technology. Intead, the fab will start with GlobalFoundries’ 22nm FD-SOI process. “Ch... » read more

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