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Blog Review: March 24

Supply chain risks; solar threats; wafer-bonded 3D stacking.

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Arm’s Brian Cline points to a project with GlobalFoundries to demonstrate the feasibility and readiness of high-density, face-to-face, wafer-bonded 3D stacking technologies for high performance, energy-efficient designs.

Synopsys’ Taylor Armerding warns that while supply chain security risks aren’t new, the recent SolarWinds breach should make everyone pay much more attention to dependencies, and provides some tips that can help.

Cadence’s Paul McLellan considers what might happen if a major solar flare storm and resultant electromagnetic pulse, similar to one in 1859, threaten the grid and today’s electrical and electronic systems.

In a video, Siemens EDA’s Colin Walls examines the use of break statements and best practices in embedded applications.

In a blog for SEMI, NXP’s Marc Osajda explains why developing MEMS inertial measurement units (IMUs) for automated driving as well as battery pressure monitoring sensors for Li-ion EV batteries is so complex.

An Ansys writer checks out a project to build the world’s fastest sailboat, aiming for an average speed of 150 kph over 500 meters, and the key roles a kitesurf wing and hydrofoils play in the design.

Plus, check out the blogs featured in the latest Manufacturing, Packaging & Materials newsletter:

Editor Mark LaPedus warns that fab tool shortages also are cropping up.

Lam Research’s Rich Wise explains how dry resist can overcome challenges at 5nm and below.

Amkor’s Vineet Pancholi examines why testing 5G RF devices is so complex and how engineering services can help.

Coventor’s Benjamin Vincent takes inspiration from 3D NAND for the future of SRAM technology.

QP Technologies’ Ken Molitor calls for creating a more stable supply chain for the U.S. semiconductor industry.

SEMI’s Serena Brischetto and Beneq’s Sami Sneck dig into how to minimize common metal and particle contamination issues and protect against corrosion.

Semico Research’s Adrienne Downey predicts the total market will reach $127B this year; Samsung, TSMC are top spenders.

Xilinx’s Minal Sawant explains what it takes for chips to survive in space.

SEMI’s Kimberly Ekmark looks at the goal of recent governmental actions to step up competitiveness against China and rebuild manufacturing capacity.



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