Blog Review: Nov. 2

Siemens EDA’s Harry Foster examines how successful FPGA projects are in terms of verification effectiveness, finding that only 16% of all FPGA projects were able to achieve no non-trivial bug escapes into production, worse than IC/ASIC in terms of first silicon success.

Synopsys’ Jamie Boote and The Chertoff Group’s David London break down best practice guidance and directives U.S. government agencies are recommending to improve software supply chain visibility and security, and why even companies that don’t sell to the government should consider adopting them.

Cadence’s Paul McLellan checks out the State-of-the-art Heterogeneous Integrated Packaging for RF, or SHIP-RF, program and gets updates from Qorvo’s Matthew Poulton on the progress of creating automated, U.S.-based assembly and test factories.

Arm’s Paul Williamson checks out Matter and the effort to create a universal IoT standard focused on the application layer, with the goal of simplifying development for manufacturers and increasing compatibility of diverse IoT devices for consumers.

In a podcast, Infineon’s Thomas Reinhardt and Dilli Sharma chat about how Bluetooth can be deployed in industrial environment to provide secure, reliable connectivity for the vast amounts of data generated by the smart factory and industrial IoT.

In a blog for SEMI, Moov’s Steven Zhou predicts which locations are likely spots for new regional hubs of semiconductor industry development under the CHIPS and Science Act.

Ansys’ Matt Commens, Marc Swinnen, and Kelly Damalou note that silicon interposers for 2.5D/3D-IC designs face electromagnetic modeling and multiphysics simulation challenges.

Intel’s Jason Martin and Micah Sheller investigate how federated learning makes it possible to securely train models on any form of private or confidential data without putting it at risk by performing training on site and only communicating back weights and associated metadata, with the example of a medical study utilizing MRI scans from 71 healthcare institutions across 6 continents.

Plus, check out the blogs featured in the latest Systems & Design newsletter:

Technology Editor Brian Bailey explains why power could become the most important optimization consideration in the future.

Siemens EDA’s Michael White, with Google Cloud’s Peeyush Tugnawat and AMD’s Philip Steinke, advise how to avoid hitting the on-premises resource wall as compute requirements rise.

Synopsys’ Dana Neustadter finds that securing high bandwidth interfaces is key to protecting the data that moves across them.

Codasip’s Filip Benna points to a burgeoning ecosystem driving a virtuous spiral of choice and innovation.

Renesas’ Roger Wendelken shows why helping customers understand security is so important.

Synopsys’ Ian Land, Jason Niatas, and Marc Serughetti look at improving reliability at the system level and the chip level.

Ansys’ Kelly Damalou and Pete Gasperini point to some of the unexpected challenges in advanced packaging, such as interposer signal integrity.