Blog Review: Sept. 23

From the International Motor Show (IAA) in Frankfurt, NXP’s Birgit Ahlborn brings us a discussion with on the challenges to building trust in connected cars and intelligent transport systems, and what is needed to ensure security in a world of connected mobility.

From the world’s largest aircraft to terahertz wireless to the launch of a partially reusable orbital rocket, innovation is in the air with this week’s choices for top tech articles by Ansys’ Bill Vandermark. Plus, check out DARPA’s mind controlled prosthetic arm with a sense of touch.

Is accident-free driving possible? Mentor’s John Day looks at one company who made that their goal with an integrated camera and an infrared Lidar system for automatic breaking.

Take an overview of the MIPI Unified Protocol (UniPro) and MIPI M-PHY stack from a PCIe perspective with Synopsys’ Anand Shirahatti.

Cadence’s Christine Young chats with Stan Krolikoski, who leads the company’s involvement in EDA standards development, on the importance of being an active participant in the standards process.

The White House’s Dan Correa highlights the new Smart Cities Initiative, which will invest over $160 million in Federal research and create more than 25 new technology collaborations to help local communities harness the growing data revolution, low-cost sensors and research collaborations.

Are you in need of a 15.4TB flash drive? Samsung’s Jim Elliott talks about the technology that makes this possible and why it will shape the future of memory.

Even wondered how the broadcasting industry looks at chip design? ARM’s Richard Stamvik provides some of his observations from this year’s IBC event where ARM was also honored for enabling the mobile revolution that is transforming the way people consume media content.

Sensors are the driver of the IoT and many of them require lenses today. Rambus’ Aharon Etengoff talks about how a couple of companies are using their lensless smart sensors which are based on diffraction.

Check out the blogs from last week’s Manufacturing, Design & Test newsletter:

Editor in Chief Ed Sperling observes that questions about how to build future chips fall into three camps.

Executive Editor Mark LaPedus talks with Everspin’s top exec about where next-gen memory is heading.

KLA guest blogger—IMEC Fellow Guido Groeseneken—examines the tradeoff between more scaling and upsetting a finely-tuned ecosystem.

Mentor Graphics’ Jeff Wilson looks at why CMP modeling was so slow to catch on and what’s changed.

SEMI’s latest report shows that SiP and stacked die are generating lots more buzz as scaling becomes more difficult.

Semico’s Jim Feldhan finds that maximizing performance and minimizing costs will require much more industry-wide collaboration.