Blog Review: Sept. 28

Cadence’s Paul McLellan provides a glimpse of TSMC’s roadmap, including what to look for at 7nm, low-power processes, and the ecosystem around the process.

Mentor’s Stephen Pateras notes that throughout the evolution of DFT, two rules for success have persisted.

Early analysis suggests the largest DDoS attack in history, targeted at security reporter Brian Krebs, may have leveraged flaws within IoT devices, says Synopsys’ Robert Vamosi.

In this week’s top five tech picks, Ansys’ Tom Smithyman highlights saving water with a new supercomputer cooling method and reading emotions with radio waves.

Rambus’ Aharon Etengoff checks out a proposal to make memory management more efficient in programs with scattered data points in large data sets.

ARM’s Eoin McCann notes a few key things from the US government’s new policy for self-driving cars.

NXP’s Ed Kroitor shows off ten demo projects as a base for IoT designs.

Mentor’s James Paris suggests back-annotation of DFM enhancements to place and route as a way to enable a tighter integration and simply iterations as designers close timing and physical verification.

In a video, Cadence’s Lana Chan explores the history of PCI Express and how it evolved into the de facto interconnect standard it is today.

Synopsys’ Mike Amadhi highlights AAMI TIR57, a recently-approved risk management standard for medical device security.

ARM’s Bob Monkman shares an update on the open-source network function virtualization (NFV) project for the ARM architecture.

Plus, don’t miss the featured blogs from last week’s Manufacturing, Design & Test newsletter:

Editor In Chief Ed Sperling questions how much the continuation of device scaling is worth.

Executive Editor Mark LaPedus points to new and major challenges faced by the mask industry.

Applied Materials’ Ben Lee observes that the costs are still too high, but the benefits of wide bandgap materials are impressive.

Mentor Graphics David Abercrombie examines what can go wrong in double patterning auto-stitching, and what to do when it does go wrong.

Coventor’s Dalong Zhao digs into lithography hotspot detection and mitigation with 3D DCTO.

SEMI’s Heidi Hoffman looks at what is new at the manufacturing institute for flexible hybrid electronics.