Silent Data Corruption
By Ed Sperling - 16 Jul, 2025 - Comments: 0

Everyone expects their compute systems to generate the correct answer. When they don't, it's cause for alarm, because it's not always clear how long the problem has persisted. Even worse, chips and systems are now so complex that it may require a unique sequence of operations to trigger a silent data error, and they may only show up occasionally, and maybe only after months or years of use in t... » read more

Examination Of Thermal Issues Related to Hybrid Bonding of 3D-Stacked HBM
By Technical Paper Link - 16 Jul, 2025 - Comments: 0

A new technical paper titled "Thermal Issues Related to Hybrid Bonding of 3D-Stacked High Bandwidth Memory: A Comprehensive Review" was published by researchers at Chungbuk National University. Abstract "High-Bandwidth Memory (HBM) enables the bandwidth required by modern AI and high-performance computing, yet its three dimensional stack traps heat and amplifies thermo mechanical stress. We... » read more

Exploring The Latest Innovations In MIPI D-PHY And MIPI C-PHY
By Mixel - 16 Jul, 2025 - Comments: 0

Introduction  In the ever-evolving landscape of high-performance camera and display technologies, MIPI D-PHY™ and MIPI C-PHY™ specifications continue to lead the charge, setting benchmarks for low power, low latency, and high bandwidth data transmission. Building on the insights from our previous article, “Demystifying MIPI C-PHY/D–PHY Subsystem” – ... » read more

EBook: Optimizing Analog Design With Multiphysics
By Ansys - 16 Jul, 2025 - Comments: 0

As technologies like artificial intelligence (AI), 5G, electric vehicles, and high-speed computing continue to advance, analog and mixed-signal (AMS) technologies have become the unsung heroes of next-gen electronics. AMS chips are enabling smarter, faster, and more efficient systems, but traditional design approaches are struggling to keep pace. Interconnect parasitics, power integrity, photo... » read more

Blog Review: July 16
By Jesse Allen - 16 Jul, 2025 - Comments: 0

Synopsys' Bradley Geden and Manoz Palaparthi explain the difference between functional signoff and RTL signoff and why increased SoC complexity means that verification flows must now capture both the intent and the integrity of a design before it can move forward. Cadence's Frank Ferro finds that LPDDR isn't just for mobile devices anymore, with the new LPDDR6 standard bringing increased ban... » read more

Semiconductor Value Chain With A Focus On IP Providers
By Expedera - 16 Jul, 2025 - Comments: 0

By Global Semiconductor Alliance (GSA) The semiconductor industry operates within a complex and rapidly evolving ecosystem driven by continuous innovation. Central to this ecosystem is the semiconductor value chain, which includes several key stages: chip design, wafer fabrication, final assembly, and raw material sourcing. Each stage is crucial to the production and functionality of semicon... » read more

Report: The AI Efficiency Boom
By Arm - 16 Jul, 2025 - Comments: 0

Artificial Intelligence (AI) is undergoing a fundamental transformation. While early AI models were large, compute-heavy, and dependent on cloud processing, a new wave of efficiency-driven innovations is moving AI inference—the generation of model results—to the edge. Smaller models, improved memory and compute performance, and the need for privacy, low latency, and energy efficiency are dr... » read more

AI In Chip Design: Tight Control Required
By Ed Sperling - 16 Jul, 2025 - Comments: 0

Executive Outlook: Semiconductor Engineering sat down with a panel of experts to talk about what's needed to effectively leverage AI, who benefits from it, and where software-defined hardware works best, with Bill Mullen, Ansys fellow; John Ferguson, senior director of product management at Siemens EDA; Chris Mueth, senior director of new markets and strategic initiatives at Keysight; Albert Ze... » read more

Expanding Server Memory Capabilities With Multiplexed Rank DIMM (MRDIMM) Technology
By Rambus - 16 Jul, 2025 - Comments: 0

The scaling of computational power within a single, packaged semiconductor component continues to rise following a Moore’s law type curve enabling new and more capable applications including machine learning (ML), generative artificial intelligence (AI), and training and deployment of large language models (LLM). On-demand lifestyle applications like language translation, direction finding, a... » read more

Physics-Based ASICs (Normal Computing et al.)
By Technical Paper Link - 15 Jul, 2025 - Comments: 0

A new technical paper titled "Solving the compute crisis with physics-based ASICs" was published by researchers at Normal Computing Corporation, ARIA, UC Santa Barbara, University of Pennsylvania, Santa Fe Institute, Cornell University. Advanced Research Projects Agency - Energy and Yale University. Abstract "Escalating artificial intelligence (AI) demands expose a critical "compute crisis"... » read more

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