Achieve High Hotspot Detection Accuracy by Pattern Scoring


In this paper, we combined the hotspot pattern library and the rule-based scoring system into a modularized hotspot-checking rule deck running on an automatic flow. Several DFM (design for manufacture) properties criteria will be defined to build a “score board” for hotspot candidates. When hotspots in the input design are highlighted, the scoring system can identify whether a hotspot is a ... » read more

Week In Review: Manufacturing, Test


Intel Mark Bohr, a senior fellow and director of process architecture and integration at Intel, is retiring, according to the company. Bohr, who will retire at the end of February 2019, held various technology positions during his 41-year career at Intel. Here is a quick bio on Bohr. Others have also recently retired from Intel’s manufacturing unit amid a massive reorganization in the depart... » read more

Correlation Study of Actual Temperature Profile and In-line Metrology Measurements for Within-Wafer Uniformity Improvement and Wafer Edge Yield Enhancement


Authors: Fang Fang (a), Alok Vaid (a), Alina Vinslava (a), Richard Casselberry (a), Shailendra Mishra (a), Dhairya Dixit (a), Dinh Chu (b), Candice Porter (b), Da Song (b), Zhou Ren (b) Key: (a) GLOBALFOUNDRIES, 400 Stone Break Extension, Malta, NY 12020; (b) KLA-Tencor Corporation, One Technology Drive, Milpitas, CA 95035   ABSTRACT With advances in new technology it is getting m... » read more

A New Approach to Metrology


The startup Active Layer Parametrics Inc.'s ALPro 50 metrology tool offers “depth profiling of electrical properties at atomic-level resolution” —and automated processing with direct data transfer. The continuing miniaturization of microchips and nanochips has propelled the use of atomic-layer deposition and atomic-layer etch processes in semiconductor manufacturing. With miniaturizati... » read more

Tech Brief: Elements of Electroplating


Electroplating is a common manufacturing process that applies a thin layer of one metal onto another. The U.S. penny, for example, has been made of zinc with a thin, electroplated coating of copper since 1982. Jewelry and flatware are also frequently electroplated to improve visual appearance or provide wear and corrosion resistance. Today, electroplating is widely performed in the electronics ... » read more

Week in Review: IoT, Security, Auto


Internet of Things Arm made five 2019 predictions for the Internet of Things. They are: The intelligent home goes mainstream; personalized delivery options; improved health-care service; smart cities seek to improve revenue streams and citizen engagement; and smart buildings use more technology for efficiencies. The company also commissioned a worldwide survey of 2,000 consumers, conducted by ... » read more

Week In Review: Design, Low Power


The MIPI Alliance released MIPI I3C Basic v1.0, a subset of the MIPI I3C sensor interface specification that bundles 20 of the most commonly needed I3C features for developers and other standards organizations. The royalty-free specification includes backward compatibility with I2C, 12.5 MHz multi-drop bus that is over 12 times faster than I2C supports, in-band interrupts to allow slaves to not... » read more

How to nail functional safety in your next design


As the automotive industry accelerates innovation toward fully autonomous vehicles, one of the underlying values of this effort will be safer roadways. Nine in 10 vehicle accidents are caused by human error. Work underway, and future innovation in autonomous and semi-autonomous vehicles, should shrink driving fatalities by tens of thousands in much the same way that the introduction of seat bel... » read more

2018 eBeam Initiative Perceptions Survey Results


EUV confidence and multi-beam remains high in the 7th Annual Perceptions Survey – 2018 (July). EUV perceptions remain positive. 82% of respondents predict EUV in HVM by end of 2021. Only 1% predict EUV will never happen. Confidence is high again for EUV lithography in high-volume manufacturing and expectations continue to grow around actinic mask inspection for EUV. Perceptions on the nee... » read more

N7 FinFET Self-Aligned Quadruple Patterning Modeling


Authors: Sylvain Baudot, Sofiane Guissi, Alexey P. Milenin, Joseph Ervin, Tom Schram (IMEC and COVENTOR) In this paper, we model fin pitch walk based on a process flow simulation using the Coventor SEMulator3D virtual platform. A taper angle of the fin core is introduced into the model to provide good agreement with silicon data. The impact on various Self-Aligned Quadruple Patterning proces... » read more

← Older posts