Chip Industry Week In Review
By The SE Staff - 13 Dec, 2024 - Comments: 0

The 2024 IEEE International Electron Devices Meeting (IEDM) was held this week, prompting a number of announcements from: imec: Proposed a new CFET-based standard cell architecture for the A7 node containing two rows of CFETs with a shared signal routing wall in between, allowing standard cell heights to be reduced from 4 to 3.5T, compared to single-row CFETs. Integrated indium pho... » read more

Integrating Ethernet, PCIe, And UCIe For Enhanced Bandwidth And Scalability For AI/HPC Chips
By Madhumita Sanyal - 12 Dec, 2024 - Comments: 0

By Madhumita Sanyal and Aparna Tarde Multi-die architectures are becoming a pivotal solution for boosting performance, scalability, and adaptability in contemporary data centers. By breaking down traditional monolithic designs into smaller, either heterogeneous or homogeneous dies (also known as chiplets), engineers can fine-tune each component for specific functions, resulting in notable im... » read more

Why PCIe And CXL Are Essential Interconnects For The AI Era
By Lou Ternullo - 12 Dec, 2024 - Comments: 0

As the demand for AI and machine learning accelerates, the need for faster and more flexible data interconnects has never been more critical. Traditional data center architectures face several challenges in enabling efficient and scalable infrastructure to meet the needs of emerging AI use cases. The wide variety of AI use cases translate into different types of workloads. Some require high ... » read more

Addressing Reset Tree Design Challenges For Complex SoCs With Advanced Structural Checks
By Reetika - 12 Dec, 2024 - Comments: 0

As SoC designs continue to evolve, the complexity of reset architectures has grown significantly. Traditionally, clock tree synthesis has been a major focus due to timing challenges, but now reset trees demand equal attention. With multiple reset sources, designers must deal with reset trees that can be more intricate than clock trees. Errors within a reset tree can lead to serious issues, incl... » read more

Automakers And Industry Need Specific, Extremely Robust, Heterogeneously Integrated Chiplet Solutions
By Andy Heinig - 12 Dec, 2024 - Comments: 0

Chiplets offer great potential for the automotive and industrial sectors, especially as these applications often have high performance requirements but are needed only in small quantities. The modular principle behind chiplets enables efficient design and production: individual components have to be produced only once and can then be flexibly combined to create tailored solutions. This offers m... » read more

NPU Acceleration For Multimodal LLMs
By Pat Donnelly - 12 Dec, 2024 - Comments: 0

Transformer-based models have rapidly spread from text to speech, vision, and other modalities. This has created challenges for the development of Neural Processing Units (NPUs). NPUs must now efficiently support the computation of weights and propagation of activations through a series of attention blocks. Increasingly, NPUs must be able to process models with multiple input modalities with ac... » read more

Is In-Memory Compute Still Alive?
By Bryon Moyer - 12 Dec, 2024 - Comments: 0

In-memory computing (IMC) has had a rough go, with the most visible attempt at commercialization falling short. And while some companies have pivoted to digital and others have outright abandoned the technology, developers are still trying to make analog IMC a success. There is disagreement regarding the benefits of IMC (also called compute-in-memory, or CIM). Some say it’s all about reduc... » read more

Dual-Grid Interpolation: For Improved Accuracy Of Overset Grid Systems
By Veena Parthan - 12 Dec, 2024 - Comments: 0

Computational fluid dynamics (CFD) has become an integral part of engineering decision-making, providing a deeper understanding of how fluids behave in various scenarios, from the high skies in aerospace all the way to the fast-paced realm of automotive engineering. The task of accurately simulating fluid dynamics, particularly when faced with complex shapes or moving parts, demands innovative ... » read more

Chiplet Interconnects Add Power And Signal Integrity Issues
By Adam Kovac - 12 Dec, 2024 - Comments: 0

The flexibility and scalability offered by chiplets make them an increasingly attractive choice over planar SoCs, but the rollout of increasingly heterogeneous assemblies adds a variety of new challenges around the processing and movement of data. Nearly all of the chiplets in use today were designed in-house by large systems companies and IDMs. Going forward, third-party chiplets will begin... » read more

Ghostbusting With Simulation: Solving Engineering Challenges In Automotive Radar Development
By Laura Carter - 12 Dec, 2024 - Comments: 0

Probably the biggest trick to the adoption of full autonomy in the automotive space is learning how to safely achieve a level of perception that matches that of a human driver. Carmakers are rising to the challenge with a combination of advanced camera, radar, and lidar sensing technologies, machine learning, and artificial intelligence that makes self-driving possible. This includes the adva... » read more

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