Securing Terabit Ethernet For AI: Where MACsec, IPsec, And UET TSS Each Fit (And Why You Need More Than One)
By Vincent van der Leest - 04 Jun, 2026 - Comments: 0

As AI and HPC systems scale, the network has become both a critical enabler of performance and a rapidly expanding attack surface. The shift from rack-scale compute to cluster- and data center-scale AI infrastructure means that data is no longer confined to a single chip, board, or even system. Instead, it moves continuously across hundreds, or thousands, of endpoints, often at aggregate bandwi... » read more

Breaking The “Unhackable” Xbox One
By Jasper van Woudenberg - 04 Jun, 2026 - Comments: 0

For more than a decade, the Xbox One stood out as one of the most resilient consumer devices ever built. While other consoles from the same era were eventually jailbroken or modified, the Xbox One remained largely untouched. Its layered defenses, hardened boot process, and strong cryptographic foundations earned it a reputation as effectively “unhackable.” That assumption changed at RE//... » read more

Beyond PCIe Compliance: Why Stress Testing Is Crucial For Edge AI Deployments
By Joe Chen - 04 Jun, 2026 - Comments: 0

Passing PCI Express (PCIe) compliance is different from being ready for the field. A PCIe link can clear every test in a controlled lab environment and still develop margin problems six months into deployment. That’s because a compliance traffic generator isn’t designed to replicate real-world operating conditions, such as thermal stress, electrical noise, and the kind of bursty inference t... » read more

Defending Smart Homes Against AI Cyber Attacks
By Steve Hanna - 04 Jun, 2026 - Comments: 0

In recent months, the cybersecurity capabilities of Large Language Models have become increasingly powerful. Recent research shows that today’s frontier models (Claude Mythos and OpenAI GPT 5.5) with proper tooling have cybersecurity capabilities similar to trained cybersecurity practitioners and are doubling their ability every four months. Access to these frontier models has been restricted... » read more

Delivering Automotive-Grade Quality With Customized FinFET Foundation IP
By Andrew Appleby - 04 Jun, 2026 - Comments: 0

By Andrew Appleby, Daryl Seitzer, and Nafiz Ahmed The growing compute demands of modern vehicles are forcing chipmakers to venture into new territory. To deliver increased processor performance for engine and body control systems, one leading semiconductor supplier knew it had to move to an automotive-qualified FinFET technology process — a leap that would introduce significant new desi... » read more

The Edge LLM Offload Story
By Karthikeyan Shanmuga Vadivel - 04 Jun, 2026 - Comments: 0

By Karthikeyan Shanmuga Vadivel and Sauryadeep Pal Developers and system architects today face a growing demand to enable large language model variants on device. They are facing pressure to support transformer-capable models on constrained devices to ensure data privacy, eliminate cloud API charges, and provide offline reliability. On-device execution is also becoming a necessity to meet st... » read more

RISC-V And GPU Synergy In Practice: A Path Toward High-Performance SoCs
By Ke Xu - 04 Jun, 2026 - Comments: 0

With the rapid growth of edge AI and high-performance computing demands, the division of roles within the processor industry is beginning to shift. Recent moves from the dominant CPU IP supplier has increased industry attention on the openness and ecosystem neutrality of the supply chain. Against this backdrop, the value of RISC-V CPU IP is becoming more evident. It offers chipmakers greater... » read more

Scaling Nanoribbon Transistors with Monolayer TMDs (Stanford, Chalmers, Horiba, SLAC)
By Technical Paper Link - 03 Jun, 2026 - Comments: 0

Researchers from Stanford University, Chalmers University of Technology, HORIBA Scientific, and SLAC National Accelerator Laboratory have published “Scaling nanoribbon transistors with monolayer transition metal dichalcogenides”. Abstract “Nanoscale transistors demand aggressive scaling of all channel dimensions—length, width and thickness. Two-dimensional semiconductors (2DS... » read more

Blog Review: Jun. 3
By Jesse Allen - 03 Jun, 2026 - Comments: 0

Siemens' Gordon Allan contends that verification IP gives design teams a practical way to verify standards-based interfaces and memories without rebuilding the same infrastructure generation after generation and shares key evaluation metrics. Synopsys' Sutirtha Kabir suggests that successful multi-die design will require deeper collaboration from early architecture exploration to manufacturi... » read more

1 Megawatt Racks In Data Centers
By Ed Sperling - 03 Jun, 2026 - Comments: 0

The demand for performance in an AI data center is causing a huge spike in the amount of power being consumed. Within a rack are a half-dozen SoC components housed in different types of advanced packages and connected with an assortment of blazing-fast interface IP and optical signaling. Manmeet Walia, director of product management for mixed-signal PHY IP in the Synopsys Solutions Group, talks... » read more

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