Is There Any Hope For Asynchronous Design?
By Brian Bailey - 25 Apr, 2024 - Comments: 3

In an era when power has become a fundamental design constraint, questions persist about whether asynchronous logic has a role to play. It is a design style said to have significant benefits and yet has never resulted in more than a few experiments. Synchronous design utilizes a clock, where the clock frequency is set by the longest and slowest path in the design. That includes potential var... » read more

Revitalizing DAC
By Brian Bailey - 25 Apr, 2024 - Comments: 0

The 61st Design Automation Conference is just two months away and as I get closer to retirement, I know there will only be a few remaining for me. I entered the EDA industry in 1980, so have been involved with it for almost 45 years. Over that period, I have only missed a few. It is interesting how the conference has changed over the years. In the early days, DAC was only a conference, where... » read more

The 3D-IC Multiphysics Challenge Dictates A Shift-Left Strategy
By John Ferguson - 25 Apr, 2024 - Comments: 0

As the industry marches forward in a 3D-IC centric design approach (figure 1), we are facing a new problem. Sometimes referred to as “electro-thermal” or “electro-thermo-mechanical,” it really is the confluence of multiple forms of physics exerting impacts on both the physical manufacture and structure of these multi-die designs and their electrical behavior. Fig. 1: Illustration... » read more

Verification In Crisis
By Ashish Darbari - 25 Apr, 2024 - Comments: 0

Why is it still so hard to ensure good quality sign-off happens without leaving behind bugs in silicon? The answer, according to my colleagues at DVCon, is highly nuanced. The industry has been improving overall, as has the complexity of designs. For ASICs, 74% of the designs surveyed in the recent Wilson Research Group/Siemens EDA report have one or more processor cores, 52% have two or mor... » read more

The Path Toward Future Automotive EE Architectures
By Frank Schirrmeister - 25 Apr, 2024 - Comments: 0

From a semiconductor market perspective, all eyes are on the automotive domain. According to Gartner, as of 2023, the automotive market is now its second-largest segment, with about 14% of the demand. Only smartphones consume more. As I mused last month in "Automotive Semiconductor March Madness 2024," those who made a bet on automotive a decade or longer ago are pretty happy these days. Still,... » read more

How To Get The Most Out Of Gate-All-Around Designs
By Andrew Appleby - 25 Apr, 2024 - Comments: 0

The semiconductor industry has relied on finFETs, three-dimensional field-effect transistors with thin vertical fins, for many generations of technology. However, the industry is reaching the limits of how much finFETs can be shrunk while maintaining their speed and power benefits, which are crucial for artificial intelligence (AI) and machine learning (ML) applications. The solution is the gat... » read more

Exploring The Security Framework Of RISC-V Architecture In Modern SoCs
By Anika Sunda - 25 Apr, 2024 - Comments: 0

In the rapidly evolving world of technology, system-on-chip (SoC) designs have become a cornerstone for various applications, from automotive and mobile devices to data centers. These complex systems integrate multiple processors, a multi-level cache hierarchy, and various subsystems that share memory and system resources. However, this open access to shared memory and resources introduces pote... » read more

How 6G Research Will Revolutionize Mobile Experiences
By Ben Coffin - 25 Apr, 2024 - Comments: 0

By 2030, 6G is expected to be commercially available, revolutionizing connectivity with lightning-fast speeds, unprecedented bandwidths, and ultra-low latencies. It will transform various sectors, including telecommunications, manufacturing, healthcare, transportation, and entertainment. In this article, get a glimpse of the 6G world coming to us over the next decade, and explore the 6G rese... » read more

TSMC Uncorks A16 With Super Power Rail
By Barry Pangrle - 25 Apr, 2024 - Comments: 0

TSMC showed off its forthcoming A16 process technology node, targeted for the second half of 2026, at its 30th North American Technology Symposium this week. As the foundry moves from nanometer to angstrom process numbering, the new nodes will be prefixed with an “A” designation (instead of “N”) and A16 is the first for TSMC. TSMC said that N2 is still tracking to a 2025 production s... » read more

Reduce 3D-IC Design Complexity: Early Package Assembly Verification
By Siemens EDA - 24 Apr, 2024 - Comments: 0

Uncover the unique challenges, along with the latest Calibre verification solutions, for 3D-IC design in this new technical paper. As 2.5D and 3D-ICs redefine the possibilities of semiconductor design, discover how Siemens is leading the way in verifying complex multi-dimensional systems, while shifting verification left to do so earlier in the design process. What you'll learn: Overcom... » read more

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