Surface Modification: Solving Semiconductor Manufacturing Challenges
By Reuben Chacko - 07 May, 2018 - Comments: 0

Process reliability and faster technology deployment are two of the most pressing manufacturing challenges currently facing the semiconductor industry. In a world of ever-evolving technology and innovation, engineers are working to transform materials that don’t possess all the desired functions through a method called “surface modification” – the act of modifying a material’s surface... » read more

How Power, Lighting, And EVS Improve Rotorcraft Safety And Performance
By Astronics - 07 May, 2018 - Comments: 0

With rotorcraft serving rugged duty across a wide spectrum of mission-critical industries including firefighting, police work, emergency medical services (EMS), oil and gas transport, and search and rescue (SAR), integrating new technologies optimizes the safety and operational performance of the vehicle. Whether line-fit or retrofit, rotorcraft that operate in rugged, degraded environments dep... » read more

Understanding NI CompactRIO Scan Mode
By NI - 07 May, 2018 - Comments: 0

The LabVIEW Real-Time Module 8.6 introduced powerful new features for programming CompactRIO hardware that reduce development time and complexity as well as provide tools for monitoring and maintaining CompactRIO applications. This functionality is powered by two technologies in LabVIEW, the NI Scan Engine and the RIO Scan Interface. The NI Scan Engine is a new component of LabVIEW Real-Time th... » read more

MIS Packaging Takes Off
By Mark LaPedus - 07 May, 2018 - Comments: 0

Momentum is building for IC packages based on an emerging technology called molded interconnect substrate (MIS). ASE, Carsem, JCET/STATS ChipPAC, Unisem and others are developing IC packages based on MIS substrate technology, which is ramping up in the analog, power IC and even the cryptocurrency markets. MIS starts with a specialized substrate material for select IC packages. The MIS sub... » read more

Software-Defined Test And Measurement
By Jeff Dorsch - 07 May, 2018 - Comments: 0

Software-defined radios, instrumentation and test are ramping up alongside a flood of new technologies related to assisted and autonomous vehicles, 5G, and military/aerospace electronics, breathing new life and significant change into the test and measurement market. Software-defined test adds flexibility in markets where the products and protocols are evolving or still being defined, and wh... » read more

Toward Project-Based Learning
By Bhavesh Mistry - 07 May, 2018 - Comments: 0

Project-based learning is one of the most frequently referenced learning models in engineering education. Since the 1990s, it has been an important movement in ensuring that students are building the correct expertise throughout the engineering curriculum by applying theory through hands-on activities. Engineering education has transitioned from a focus on the practice of engineering (design... » read more

Packaging Chips For Cars
By Jeff Dorsch - 07 May, 2018 - Comments: 2

As the complexity of automotive chips grows, so does the complexity of the package. In fact, packaging is becoming increasingly crucial to the performance and reliability of the chips, and both parts need to meet stringent safety standards before they are used inside a vehicle. This is true for all safety-critical applications, but for automotive in particular there are several key reasons w... » read more

Package Designers Need Assembly-Level LVS For HDAP Verification
By Mentor, a Siemens Business - 07 May, 2018 - Comments: 0

While advanced IC packaging is a fast-growing market, comprehensive package verification still has a ways to go. Unique package connectivity issues, such as missing or misplaced interposer/package bumps/pads, pin naming and text labeling issues, and the like, require new and enhanced LVS-like verification techniques that can move across the entire package to ensure proper connectivity and perfo... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 04 May, 2018 - Comments: 0

Chipmakers Consumers recently filed a class-action suit against the three DRAM makers, alleging that they illegally agreed to raise prices for their respective memory products. The suit, filed in the U.S. District Court for the Northern District of California, alleges that Samsung, Micron and Hynix agreed to limit the supply of DRAM, driving up prices for this widely used memory. The pri... » read more

The Week in Review: IoT
By Jeff Dorsch - 04 May, 2018 - Comments: 0

Cybersecurity Arm this week introduced the Cortex-M35P processor with anti-tampering technology and software isolation. The company also debuted security intellectual property to protect Internet of Things devices from physical cyberattacks and close proximity side-channel attacks. Paul Williamson, Arm’s vice president and general manager of the IoT Device IP line of business, provides more ... » read more

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