Virtualizer Native Execution Accelerates Software Defined Product Development for Arm Solutions
By Synopsys - 26 Mar, 2025 - Comments: 0

This whitepaper highlights advancements in virtual prototyping with near native execution performance. The adoption of Arm processor architecture in automotive and data centers is driven by software complexity and ECU consolidation. This shift elevates virtualization performance requirements, supported by Arm's mature software ecosystem. Key Takeaways: Adoption of and convergence of bot... » read more

Dynamic Characterization Of A Power Semiconductor Bare Chip
By Keysight - 26 Mar, 2025 - Comments: 0

Power semiconductor devices are used in a variety of forms, such as being packaged in Surface Mount Devices (SMDs) or power modules, and they find broad applications. Power semiconductor bare chips are loaded into these packages. It is desirable to characterize the bare chip before placing it in a package or a power module to expedite development. However, the small size, fragile structure, and... » read more

Accelerate And Derisk RISC-V- Based SoC Designs
By Arteris - 26 Mar, 2025 - Comments: 0

How to accelerate and derisk RISC-V-based SoC designs using silicon-proven network-on-chip IP and SoC integration automation software. This technology seamlessly connects any IP from multiple vendors and shortens design cycles and time to revenue. Maximize overall efficiency for the best product design, leveraging the best NoC IP and expert support. Read more here. » read more

The Evolving Role Of AI In Verification
By Ann Mutschler - 26 Mar, 2025 - Comments: 0

Experts At The Table: The pressure on verification engineers to ensure the functional correctness of devices has increased exponentially as chips have gotten more complex and evolved into SoC, 3D-ICs, multi-die chiplets and beyond. Semiconductor Engineering sat down with a panel of experts, which included Josh Rensch, director of application engineering at Arteris; Matt Graham, senior group dir... » read more

Blog Review: Mar. 26
By Jesse Allen - 26 Mar, 2025 - Comments: 0

Siemens' Bianca Ward argues that sustainability must be considered starting from the design phase to reduce the energy consumption of ICs as well as the production processes used to manufacture them. Synopsys' Adrien Tozzoli looks at how physical optics simulation can be improved by using beam synthesis propagation, a method that decomposes the optical field into a collection of beamlets to ... » read more

Allegro X AI for Generative System Design
By Cadence - 26 Mar, 2025 - Comments: 0

PCB design is the act of realizing a schematic into a physical form. Currently, human designers use electronic design automation (EDA) software to combine component placement and routing to realize the electrical connectivity on a manufacturable PCB. Computer-aided design (CAD) tools have been used in the design flow since the 1970s and are now an essential part of the designer’s toolkit. Som... » read more

Fully Digital Adaptive PMU-MCU System For Hybrid (Battery-Harvester) IoT Devices
By Technical Paper Link - 25 Mar, 2025 - Comments: 0

A new technical paper titled "An Ultra-Low-Leakage Microcontroller with Configurable Power Management for Energy Harvesting IoT Devices" was published by researchers at Eindhoven University of Technology and Innatera Nanosystems. Abstract "This paper presents a power management unit (PMU) architecture designed for energy-harvesting IoT devices, integrating a dual-capacitor system, an ultra-... » read more

HW Implementation Of An ONN Coupled By A ReRAM Crossbar Array (IBM, TU Eindhoven)
By Technical Paper Link - 25 Mar, 2025 - Comments: 0

A new technical paper titled "Hardware Implementation of Ring Oscillator Networks Coupled by BEOL Integrated ReRAM for Associative Memory Tasks" was published by researchers at IBM Research Europe and Eindhoven University of Technology. Abstract "We demonstrate the first hardware implementation of an oscillatory neural network (ONN) utilizing resistive memory (ReRAM) for coupling elements. ... » read more

Research Bits: Mar. 25
By Jesse Allen - 25 Mar, 2025 - Comments: 0

2D materials in 3D transistors Researchers at the University of California Santa Barbara investigated 3D gate-all-around (GAA) transistors made using 2D semiconductors. They considered three different approaches to channel stacking: nano-sheet FETs, nano-fork FETs, and nano-plate FETs. The nano-plate FET architecture, which exploits lateral stacking of 2D layers, was found to maximize the g... » read more

Experimental Characterization Results and State-of-the-Art Device-Level Studies of DRAM Read Disturbance
By Technical Paper Link - 25 Mar, 2025 - Comments: 1

A new technical paper titled "Revisiting DRAM Read Disturbance: Identifying Inconsistencies Between Experimental Characterization and Device-Level Studies" was published by researchers at ETH Zurich. Abstract "Modern DRAM is vulnerable to read disturbance (e.g., RowHammer and RowPress) that significantly undermines the robust operation of the system. Repeatedly opening and closing a DRAM ro... » read more

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