EDA’s Role Grows For Preventing And Identifying Failures


The front end of design is becoming more tightly integrated with the back end of manufacturing, driven by the rising cost and impact of failures in advanced chips and critical applications. Ironically, the starting point for this shift is failure analysis (FA), which typically happens when a device fails to yield, or worse, when it is returned due to some problem. In production, that leads t... » read more

LPDDR5X: High Bandwidth, Power Efficient Performance For Mobile & Beyond


Looking back over recent history in the memory landscape, we can clearly see a trend of new applications growing sufficiently large enough to command the creation of new memory technologies tailored to their specific needs. We saw this with the creation of GDDR for graphics and later HBM for AI/ML applications. Low-Power Double Data Rate (LPDDR) emerged as a specialized memory designed for mobi... » read more

Fast Time-To-Digital Converters As Ultra-Precise Stopwatches For Quantum Technologies


Quantum technologies enable versatile novel applications in modern engineering topics such as information processing, communication or sensing. In particular, photonic quantum technologies are an innovative field of development which, based on the quantization of light, implements a qubit for example in the polarization or phase of a single photon, or in other degrees of freedom of the electrom... » read more

Using Virtual Metal Fill To Solve Real Design Problems


People learning about semiconductor manufacturing might well be confused by the concept of metal fill. It seems perfectly intuitive that laying out a complex chip will result in some regions with fewer transistors and metal interconnect than others. It makes sense that there will be areas that are mostly empty. So why spend money on more complicated masks and on extra metal just to fill those e... » read more

How To Answer Five Common Questions About Power Module Current Density


Power module current density is an important factor in determining the efficiency and performance of power modules. This article answers five common questions about power module current density so you can make informed decisions when designing a power module for your application. 1. How many wire bonds are required? Generally, a higher current density requires an increased number of w... » read more

4 Ways To Design More Reliable Automotive Electronics


From engine management systems (fuel injection rate, emissions control, cooling systems) and autonomous controls (lane, speed, park assist, adaptive cruise control) to infotainment systems and comfort systems (climate control, electronic seat adjustment, automatic wipers, etc.), the modern-day gas-powered and electric vehicles have more electronic devices than ever. Indeed, the microprocessors ... » read more

How To Address The Top 5 Silicon Startup Challenges


From our 30 years of experience, Arm understands that designing silicon can be complex and expensive. Against the backdrop of global supply chain issues and wider economic challenges, today’s climate can be challenging for the tech industry, particularly those creating the next wave of silicon products. Startups are looking for every opportunity to maximize their success with their first t... » read more

An Evaluation of Quantum Algorithms On Classical Hardware Using The CuQuantum Framework


A technical paper titled “Simulating Noisy Quantum Circuits for Cryptographic Algorithms” was published by researchers at Virginia Tech. Abstract: "The emergence of noisy intermediate-scale quantum (NISQ) computers has important consequences for cryptographic algorithms. It is theoretically well-established that key algorithms used in cybersecurity are vulnerable to quantum computers due ... » read more

Advantages, Disadvantages, And Use Cases Of FPGAs


A technical paper titled “Data Processing with FPGAs on Modern Architectures” was published by researchers at ETH Zürich. Abstract: "Trends in hardware, the prevalence of the cloud, and the rise of highly demanding applications have ushered an era of specialization that is quickly changing the way data is processed at scale. These changes are likely to continue and accelerate in the next... » read more

Nanosheet GAAFETs: Compact Modeling (Politecnico di Torino)


A technical paper titled “NS-GAAFET Compact Modeling: Technological Challenges in Sub-3-nm Circuit Performance” was published by researchers at Politecnico di Torino. Abstract: "NanoSheet-Gate-All-Around-FETs (NS-GAAFETs) are commonly recognized as the future technology to push the digital node scaling into the sub-3 nm range. NS-GAAFETs are expected to replace FinFETs in a few years, as ... » read more

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