category: Blogs – LPHP

category: IoT, Security & Automotive

Leveraging Foundation IP For Low-Power AI Processor Development
By Shruti Bagaria - 15 Apr, 2025 - Comments: 0

Artificial intelligence (AI) has become widespread in recent years, quickly establishing itself as a groundbreaking technology. AI operates on machine learning (ML) algorithms, which demand substantial computational power. Traditionally, designers have utilized graphics processing units (GPUs) to run these ML algorithms. Initially created for graphics rendering, GPUs have shown to be highly eff... » read more

Are You Ready For AI?
By Brian Fuller - 10 Apr, 2025 - Comments: 0

The semiconductor industry sits at the heart of the artificial intelligence revolution, providing the essential computational foundation that powers AI's rapid evolution. However, new research suggests that while AI adoption is accelerating globally, strategic implementation remains a significant challenge across industries. According to the recently released Arm AI Readiness Index Report, 8... » read more

Lego-Style Software For Automotive And Industrial Chiplet Systems?
By Andy Heinig - 10 Apr, 2025 - Comments: 0

Chiplets are a key topic in the semiconductor industry today, as they offer the potential to greatly increase the performance and flexibility of chips. The current focus is primarily on implementation, in particular on the architecture and the development of die-to-die interfaces that enable efficient communication between the individual chips. These technologies hold out the promise of meeting... » read more

Delivering Breakthrough Performance And Power Efficiency With PCIe 6
By Lou Ternullo - 10 Apr, 2025 - Comments: 0

PCI Express (PCIe) has been the backbone of high-speed data transfer in computing systems for nearly two decades. With each iteration, PCIe has not only increased data bandwidth but also introduced innovations aimed at enhancing power efficiency—a critical factor in today's energy-conscious computing environment. PCIe 6 introduced significant technical improvements that optimize power consump... » read more

Thermal Analysis Of 3D Stacking And BEOL Technologies
By Mohamed Naeim - 10 Apr, 2025 - Comments: 0

Thermal challenges in 3D-IC designs can cause a significant risk in meeting performance specifications. While the pace of Moore’s Law has slowed in recent years, system technology co-optimization (STCO) promises to mitigate technology scaling bottlenecks with system architecture tuning based on emerging technology offerings, including 3D technology. AI-driven inference accelerators continu... » read more

Electronics Reliability In Space: Simulating Rad Hard Designs
By Aliyah Mallak - 10 Apr, 2025 - Comments: 0

Space is a harsh environment. There’s no breathable air, radiation levels are 15 times higher than on Earth, and the approximate temperature is 2.7 Kelvin (minus 270.45 degrees Celsius or minus 454.81 degrees Fahrenheit). Thankfully, Earth’s atmosphere does a great job protecting us from space’s intense climate. But because there is no atmosphere in space, there’s nothing to protect sat... » read more

Easier Assertion Development And Debug With Simulation Replay
By Vin Liao - 13 Mar, 2025 - Comments: 0

By Vin Liao and Robert Ruiz Assertions and assertion IP (AIP) are a core part of the register transfer level (RTL) verification environment for all modern chip development projects. Assertions can be considered as statements of design intent, specifying how the design should behave—and not behave—under specified conditions. They range from simple statements, for example, that a multi-bit... » read more

Enabling Next-Generation Automotive Zonal Architecture With MIPI
By Raj Uppala - 13 Mar, 2025 - Comments: 0

The evolution of automotive architecture has followed three key stages: distributed architecture, domain-centralized architecture, and emerging zonal architecture. Each stage reflects advancements in functionality, complexity, and efficiency. Distributed architecture, prevalent in early vehicles, relied on numerous function-specific Electronic Control Units (ECUs). While effective for modularit... » read more

Fulfilling 3D-IC Trade-Off Analyses (And Benefits) With An AI Assist
By Pratyush Kamal - 13 Mar, 2025 - Comments: 0

As we walk around with supercomputers in our pockets and work at desks on even more powerful supercomputers, a lot of processing has moved to the cloud. As a politician described, this can be problematic on a day when there are no clouds in the sky. The world discovered the truth of those words when Crowdstrike struck on July 19, 2024. System designers who spent years balancing power, performan... » read more

Static Timing Analysis: Cell Delay Vs. Cell Drive Strength
By Pamula Sai Srinivas - 13 Mar, 2025 - Comments: 0

Have you ever wondered how a predator succeeds or its prey escapes in the jungle? It’s the breathtaking speed and agility of the predator (say, a leopard) as it chases prey (say, a deer). The VLSI circuit operation is very similar. If the driving cell is strong, it takes less delay and changes the output quicker than a weaker driver, which produces a sluggish response and takes longer t... » read more

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