category: Blogs – MD

category: IoT, Security & Automotive

SiPs And MCMs Broaden Opportunities For Military-Aerospace System Design
By Rosie Medina - 23 May, 2022 - Comments: 0

Military and aerospace (mil-aero) applications, from satellites and rockets to ships and planes, increasingly require electronic systems and subsystems with high functionality and performance in a small form factor. Meeting these demands poses higher-level challenges for packaging of these microelectronic devices, which needs to be rugged, long-lived, and affordable. Usage of multi-chip modu... » read more

There Is Plenty Of Room At The Top: Imagining Miniaturized Electro-Mechanical Switches In Low-Power Computing Applications
By Gerold Schröpfer - 19 May, 2022 - Comments: 0

The first computers were built using electro-mechanical components, unlike today’s modern electronic systems. Alan Turing’s cryptanalysis multiplier and Konrad Zuse’s Z2 were invented and built in the first half of the 20th century, and were among the first computers ever constructed. Electro-mechanical switches and relays performed logic operations in these machines. Even after computers... » read more

The Drive Toward Zero Defects
By Prasad Dhond - 19 May, 2022 - Comments: 0

The automotive semiconductor market has doubled twice in the past 20 years. But the next doubling will be even faster. While short-term results may vary, it is certain that auto semis will be much larger 10-20 years from now. Today, a gas-powered car has ~$400 of semiconductor content whereas the Tesla Model 3 with an electric powertrain and Advanced Driver Assist System (ADAS) has >4... » read more

The Changing Mask Landscape
By Jan Willis - 19 May, 2022 - Comments: 0

Semiconductor photomasks have undergone some major technology changes in the past few years after relatively minor changes for many years. New technologies such as multi-beam mask writers and extreme ultraviolet (EUV) lithography are major breakthroughs as they ramp into high-volume manufacturing. A new trend related to these technologies is the use of curvilinear features on photomasks. Aki... » read more

Our Wireless World: How Wi-Fi 6 Will Seamlessly Integrate With 5G To Help Keep Us Connected
By David Haynes - 19 May, 2022 - Comments: 0

Most of us have a good understanding of what 5G is by now. Buzz around the fifth-generation wireless technology has reached a fever pitch – and for good reason.  It offers significantly greater bandwidth, faster connectivity, and lower latency, enabling it to power a much broader range of digital applications than its predecessors. 5G is ushering in a new wave of business and societal trans... » read more

Reducing Greenhouse Gases In Manufacturing
By Jessica Albright - 19 May, 2022 - Comments: 0

Businesses must reduce their environmental impact. One of the most significant ways to do this is by reducing their carbon footprint, and this starts with monitoring carbon emissions. Carbon emissions are responsible for 81% of overall greenhouse gas (GHG) emissions, and businesses are responsible for a lot of it. The rest of the GHG emissions are methane (10%), nitrous oxide (7%) and fluorin... » read more

Deep Tech Drives Semiconductor Sustainability
By Serena Brischetto - 19 May, 2022 - Comments: 0

SEMI spoke with Luc Van den hove, president and CEO at Imec, about semiconductor sustainability, healthcare trends, and deep tech, and their implications for the semiconductor industry. Van den hove shared his views ahead of his keynote presentation at SEMI Industry Strategy Symposium Europe (ISS Europe), on May 30, 2022, in Brussels, Belgium. Join us at the event to meet experts from Imec... » read more

Chipping In For Equipment Suppliers: The Equipment Multiplier Effect On The Chip Shortage
By Ajit Manocha - 02 May, 2022 - Comments: 0

By Ajit Manocha and Sanjay Malhotra Global semiconductor supply imbalances have hindered countless industries including essential segments such as automotive and medical as well as workers and consumers. Around the world, policymakers are increasing semiconductor manufacturing capacity to strengthen supply chains and meet growing demand for semiconductors through robust incentive packages to... » read more

BEOL Integration For The 1.5nm Node And Beyond
By Assawer Soussou - 25 Apr, 2022 - Comments: 0

As we approach the 1.5nm node and beyond, new BEOL device integration challenges will be presented. These challenges include the need for smaller metal pitches, along with support for new process flows. Process modifications to improve RC performance, reduce edge placement error, and enable challenging manufacturing processes will all be required. To address these challenges, we investigated th... » read more

Challenges For Achieving Automotive Grade 1/0 Reliability In FCBGA and fcCSP Packages
By Knowlton Olmstead - 21 Apr, 2022 - Comments: 0

As the quantity, complexity, and functions of electronic devices in automobiles increase, understanding and characterizing package reliability is of significant concern and importance. The Automotive Electronics Council (AEC) Q-100 specification for Grade 1 and 0 reliability introduces unique challenges as thermal cycling (TC) and high temperature storage (HTS) requirements increase. Additional... » read more

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