category: Blogs – MD

category: IoT, Security & Automotive

How AiP/AoP Technology Helps Enable 5G And More
By Brendan Wells - 16 Feb, 2023 - Comments: 0

For 5G smartphones and other millimeter wave (mmWave) applications, antenna integration off the board and into the package, simplifies the design challenges endemic to high-frequency devices. These challenges include signal loss, signal integrity, and power supply limitation. Antenna in Package (AiP) and Antenna on Package (AoP) constructions provide the required form, fit and function for high... » read more

The Other Side Of The Wafer: The Latest Developments In Backside Power Delivery
By Sandy Wen - 16 Feb, 2023 - Comments: 0

At the beginning of my career in semiconductor equipment, the backside of the wafer was a source of anxiety. In one memorable instance in my early career, several wafers flew off a robot blade during a wafer transfer. After cleaning up the mess, we remembered that a variety of thin films could be deposited on the wafer backside, which could decrease its friction coefficient. Slowing down the wa... » read more

Tomorrow’s Semiconductor Workforce
By Raj Jammy - 16 Feb, 2023 - Comments: 1

With tens of billions directly allocated to spur growth in this essential industry, now is the time for us to focus on a critical challenge: ensuring that as this industry grows exponentially, we create a pipeline for the next generation of semiconductor workers, from the manufacturing floor to the design suites. The semiconductor industry’s growth will ripple throughout the nation, creating ... » read more

As Chiplets Go Mainstream, Chip Industry Players Collaborate to Overcome New Development Challenges
By Ashley Huang - 16 Feb, 2023 - Comments: 0

The semiconductor industry is building a comprehensive chiplet ecosystem to seize on the advantages of the devices over traditional monolithic system-on-chips (SoCs) such as improved performance, lower power consumption, and greater design flexibility. With heterogeneous integration (HI) presenting significant challenges, collaboration to fulfill the potential of chiplets has become even more i... » read more

Mapping The Future Of Lithography
By Harry Levinson - 16 Feb, 2023 - Comments: 0

The SPIE Advanced Lithography + Patterning (AL+P) Symposium is always an informative event for lithographers, and looking at the Advance Program, it appears that AL+P 2023 will be no exception. The progress being made on key lithographic challenges is consistently of interest to attendees, and there will be many timely presentations that address issues of current significance. For example, r... » read more

An OSAT Perspective On Semiconductor Market Trends
By Vik Chaudhry - 19 Jan, 2023 - Comments: 0

For the semiconductor industry, 2022 was a very interesting year. On one hand, it witnessed shortages in the supply chain. On the other hand, the macro-economic situation turned and demand for several consumer and computing devices plummeted. A trade war with China and ensuing localization of supply chain with passage of CHIPS act took shape in 2022. The auto industry is still recovering from t... » read more

Supply Chain Collaboration Key To Making Chip Industry More Sustainable
By Cassandra Melvin - 19 Jan, 2023 - Comments: 0

Coming in the wake of the COP27, the Smart and Green Manufacturing Summit at SEMICON Europa 2022 (Munich, 15-17 November) had a timely focus on the semiconductor industry’s contribution to meeting the United Nations’ target of limiting global warming to 1.5°C above pre-industrial levels. However, in an industry as large and valuable as semiconductors, social as well as environmental imp... » read more

Multi-Beam Mask Writers Are A Game Changer
By Jan Willis - 22 Dec, 2022 - Comments: 0

The eBeam Initiative’s 11th annual Luminaries survey in 2022 reported strong purchasing predictions for multi-beam mask writers, enabling both EUV and curvilinear photomask growth. A panel of experts debated remaining barriers to curvilinear photomask adoption during an event co-located with the SPIE Photomask Technology Conference in late September. Industry luminaries representing 44 compan... » read more

3D Sensing Package Solutions
By Chiung Lee - 15 Dec, 2022 - Comments: 0

By Chiung Lee, Weilung Lu, and Adrian Arcedera 3D sensing technology is rapidly being adopted in a variety of growing markets. End-product applications include smartphones, tablets, augmented/virtual reality products, robot vacuum cleaners, industry inspection machines, and automotive vehicles. As shown in figure 1, Yole Développement expects the 3D imaging and sensing market to expand from... » read more

Automotive MEMS Accelerometer Design Verification: A Real Life Example
By Arnaud Parent - 15 Dec, 2022 - Comments: 0

Standard Finite Element (FE) models, especially those that incorporate multiple physical domains, consist of detailed representations of a device that include a large number of Degrees of Freedom (DoF). The Degrees of Freedom in a design are the number of independent variables or parameters needed to describe the motion or state of the device. Generally, the larger the number of Degrees of Free... » read more

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