category: Intelligent Innovation

category: IoT, Security & Automotive

Measuring Multi-Layer Ultra-Thin Critical Films
By Jiangtao Hu - 11 Mar, 2025 - Comments: 0

Artificial intelligence is one of the driving forces in today’s semiconductor industry, with more traditional market drivers like high performance compute and smart phones continuing to play important roles. This situation is unlikely change in the years ahead as chip makers continue their quest to create the most advanced nodes. With 3nm nodes in production and 2nm nodes on the horizon, the ... » read more

Innovations Driving The Advanced Packaging Roadmap: Part Two
By Keith Best - 11 Feb, 2025 - Comments: 0

As the advanced packaging world enters the AI era, manufacturers are exploring ways to extend the life cycle of organic substrates and successfully introduce glass substrates to high volume manufacturing. In last month’s blog, “Innovations Driving The Advanced Packaging Roadmap: Part One,” we discussed the challenges of organic and glass substrates as the industry marches toward sub-2µm ... » read more

Innovations Driving The Advanced Packaging Roadmap: Part One
By Keith Best - 14 Jan, 2025 - Comments: 1

Advanced IC substrates (AICS) have been marching toward the 2µm line/space (L/S) redistribution layer (RDL) technology node for some time (figure 1). However, many questions remain about the ability of organic substrates to meet the line/space requirements of the next generation of advanced packages (AP), those below 2µm L/S and perhaps to 1.5µm L/S. Simply put: are organic substrates up to ... » read more

Getting The Biggest ROI On Your Digital Twin
By Sean King - 12 Nov, 2024 - Comments: 0

In the semiconductor industry, digital twins are the focus of a lot of attention, with substantial investments from industry players and governments alike. This year the European Union and the United States have pledged hundreds of millions of dollars in grants and funding opportunities, including the new CHIPS Digital Twin Manufacturing USA Institute. Ultimately, many people see great value in... » read more

The Long Climb: Bringing Through Glass Vias (TGV) To High-Volume Manufacturing
By Keith Best - 15 Oct, 2024 - Comments: 0

The semiconductor industry is a land of peaks and valleys. It’s a place where each innovation represents the culmination of a long and often difficult climb to the summit. In the case of glass substrates, the peak of the mountain is in sight. The arrival of glass substrates comes at an opportune time, as the industry eyes new process innovations to meet the incredible demand for high perfo... » read more

Achieving Zero Defect Manufacturing Part 3: Prevention Of Defects
By Prasad Bachiraju - 16 Sep, 2024 - Comments: 0

The concept of zero defect manufacturing has been around for decades, arising first in the aerospace and defense industry. Since then, this manufacturing approach has been adopted by the automotive industry, and it has only grown in importance as the sector transitions to electric vehicles. Given the role semiconductors play in today’s vehicles, and will play in the future, it is no surprise ... » read more

Achieving Zero Defect Manufacturing Part 2: Finding Defect Sources
By Prasad Bachiraju - 06 Aug, 2024 - Comments: 1

Semiconductor manufacturing creates a wealth of data – from materials, products, factory subsystems and equipment. But how do we best utilize that information to optimize processes and reach the goal of zero defect manufacturing? This is a topic we first explored in our previous blog, “Achieving Zero Defect Manufacturing Part 1: Detect & Classify.” In it, we examined real-time defe... » read more

Achieving Zero Defect Manufacturing Part 1: Detect & Classify
By Prasad Bachiraju - 11 Jun, 2024 - Comments: 0

Whether the discussion is about smart manufacturing or digital transformation, one of the biggest conversations in the semiconductor industry today centers on the tremendous amount of data fabs collect and how they utilize that data. While chip makers are accumulating petabytes of data across the entire semiconductor process, a question arises: how much of that information is being fully uti... » read more

The Importance Of Secure Data Sharing
By Mike McIntyre - 14 May, 2024 - Comments: 0

When it comes to data accessibility, the terms “secure” and “share” seem like two diametrically opposed words. Conventional wisdom would suggest that any effort to secure data would involve limiting access to that data, while sharing data would involve opening up access to that data for others to view and use. As it turns out, semiconductor operations need to do both. On the one h... » read more

Using Automatic Defect Classification To Reduce The Escape Rate Of Defects
By Bryce Chi - 09 Apr, 2024 - Comments: 0

Automated optical inspection (AOI) is a cornerstone in semiconductor manufacturing, assembly and testing facilities, and as such, it plays a crucial role in yield management and process control. Traditionally, AOI generates millions of defect images, all of which are manually reviewed by operators. This process is not only time-consuming but error prone due to human involvement and fatigue, whi... » read more

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