PCIe IP With Enhanced Security For The Automotive Market

By Dana Neustadter - 07 Nov, 2024 - Comments: 0

The automotive industry is undergoing a rapid transformation, with connectivity and automation becoming integral components of modern vehicles. However, this increased connectivity also brings heightened risks. The automotive industry takes many measures to ensure safety for vehicles, but it is crucial to understand that these safety measures are ineffective if the vehicle's security is comprom... » read more

Increasing Design Flexibility With RISC-V-Based Processor IP

By Rich Collins - 21 Oct, 2024 - Comments: 0

The semiconductor industry increasingly needs more flexible and scalable processor architectures, driving the growing adoption of RISC-V. Originally developed at the University of California, Berkeley, the open-source RISC-V instruction set architecture (ISA) has become very popular in recent years. RISC-V allows designers to customize their processor implementations to meet the specific needs ... » read more

Combining Silicon Data Capture And Edge Processing Offers A Promising Solution For Automotive OEMs

By Lorin Kennedy - 05 Sep, 2024 - Comments: 0

By Lorin Kennedy and Jasmin Mulaosmanovic In the world of electric (EV) and software-defined vehicles (SDV), a key challenge and opportunity besets original equipment manufacturers (OEM): that of effectively harnessing in-vehicle and silicon data to improve user experience and quite literally drive business benefits. While collecting telemetry data is straightforward enough, the difficulty l... » read more

Keeping Up With New ADAS And IVI SoC Trends

By Hezi Saar - 01 Aug, 2024 - Comments: 0

In the automotive industry, AI-enabled automotive devices and systems are dramatically transforming the way SoCs are designed, making high-quality and reliable die-to-die and chip-to-chip connectivity non-negotiable. This article explains how interface IP for die-to-die connectivity, display, and storage can support new developments in automotive SoCs for the most advanced innovations such as c... » read more

Addressing Quantum Computing Threats With SRAM PUFs

By Roel Maes - 06 Jun, 2024 - Comments: 0

You’ve probably been hearing a lot lately about the quantum-computing threat to cryptography. If so, you probably also have a lot of questions about what this “quantum threat” is and how it will impact your cryptographic solutions. Let’s take a look at some of the most common questions about quantum computing and its impact on cryptography. What is a quantum computer? A quantum comput... » read more

Earning Digital Trust

By Nathalie Bijnens - 09 May, 2024 - Comments: 0

The internet of things (IoT) has been growing at a fast pace. In 2023, there were already double the number of internet-connected devices – 16 billion – than people on the planet. However, many of these devices are not properly secured. The high volume of insecure devices being deployed is presenting hackers with more opportunities than ever before. Governments around the world are realizin... » read more

Integrating ADAS/IVI SoCs Using Automotive IP

By Ron DiGiuseppe - 04 Apr, 2024 - Comments: 0

The automotive industry continues to evolve the centralized electrical/electronic (EE) architecture, impacting automakers, and Tier 1 and Tier 2 suppliers, as they implement various applications over the next 10 years. The new architecture is structured around a centralized compute module which executes multiple applications such as Advanced Driver Assistance Systems (ADAS)/highly automated dri... » read more

Maximizing Energy Efficiency For Automotive Chips

By William Ruby - 07 Mar, 2024 - Comments: 0

Silicon chips are central to today’s sophisticated advanced driver assistance systems, smart safety features, and immersive infotainment systems. Industry sources estimate that now there are over 1,000 integrated circuits (ICs), or chips, in an average ICE car, and twice as many in an average EV. Such a large amount of electronics translates into kilowatts of power being consumed – equiva... » read more

The Proliferation Of Bluetooth In V2X Automotive Applications

By Charles Dittmer - 01 Feb, 2024 - Comments: 0

V2X, or “Vehicle to Everything,” applies to wireless communication between a vehicle and a specific entity or network. Although vehicle-to-vehicle communication projects can be traced back to the 1970s, more recently the IEEE WLAN V2X specifications released in 2010 and the 3GPP V2X specification published in 2016 have defined specific wireless standards for V2X communications. Most of the ... » read more

Key Inflection Points Influencing Bluetooth Low Energy Sourcing Decisions

By Charles Dittmer - 04 Jan, 2024 - Comments: 0

Bluetooth 5.4, the latest specification from the Bluetooth Special Interest Group (SIG), includes a number of enhancements that will open additional markets and use cases. This is one of several inflection points in the Bluetooth Low Energy (BLE) market that we will discuss in this blog. One thing I have learned over the course of my career in delivering multiple wireless products is that th... » read more

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Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

category: Safe, Secure, Smarter Cars

category: IoT, Security & Automotive