Moving To Wide Bandgap Chips


The search for new materials to replace CMOS has been in full swing for decades, but in spite of successes in limited niche markets, bulk CMOS remains king. That’s beginning to change, however, as CMOS runs out of steam at advanced process nodes and as the priorities of chipmakers change from pure performance to energy efficiency. And for such applications as automotive electronics for hyb... » read more

Fujitsu Reorgs For Manufacturing


Fujitsu officially announced its intention of reorganizing its semiconductor manufacturing businesses, including dividing the Aizu Wakamatsu factory and Mie factory as branches of the foundry companies. The rest of the organization, including the system memory department and Fujitsu Electronics will become a part of Fujitsu’s semiconductor group. The new Foundry Company will also be a part of... » read more

EUV Light Source Makes Progress


EUV Lithography light source maker, Gigaphoton has developed a laser-produced plasma (LPP) light source prototype model that can produce a maximum of 92 watts. This is more than double the 43 watts produced using a traditional LPP light source. Figure 1 conceptual diagram of EUV exposure. Source: Gigaphoton/EUVA The biggest issue with EUV lithography has been the output power of the lig... » read more

An Acquisition And A Merged Technology Strategy


A single chip capable of performing two different functions can reduce the amount of wiring needed to just one layer and it can reduce time to market by simplifying the supply chain and the planning process. Nowhere is this more evident than in the LCD chip market, where two different manufacturers were used to supply chips for touch panels. But an effort to consolidate them into a single ch... » read more

Changes In NAND Flash Market


Things are changing quickly in the NAND flash market. Newcomers are challenging long-time market leaders and shifting the lineup in this market. A survey of NAND flash vendors, conducted by DRAMeXchange, a Singapore market research firm, shows that in Q1 of this year Samsung was firmly in first place with $2.175 billion in revenues, followed by Toshiba with $1.548 billion and SanDisk with $1... » read more

The Sensor Revolution


“Sensors will transform manufacturing from now on,” said Eric Janson, senior vice president of sales and marketing at AMS (Austria Micro Systeme), an analog mixed-signal semiconductor manufacturer based in Austria. There have been many such predictions in the past—lithography, processors, memory and various materials all have been predicted to change semiconductor manufacturing. But se... » read more

Plugging Information Leaks


A former SanDisk employee was arrested on suspicion of leaking proprietary information about Toshiba’s semiconductor memory to SK Hynix. What makes this particularly interesting is SanDisk is one of Toshiba’s current business partners. The two companies have a joint venture in NAND flash, which competes with South Korea’s SK Hynix. Nihon Keizai Shimbun broke the story last month. Sugi... » read more

Executive Insight: CH Wu


Semiconductor Engineering sat down with CH Wu, president and CEO of Advantest Taiwan, to talk about business, politics, and his philosophy on what really motivates people. What follows are excerpts of that conversation. SE: Tell us a little about who you are and your background. Wu: I graduated from college with a degree in electrical engineering and started at Philips Electric, then moved ... » read more

Fill ‘Er Up With Hydrogen


Japan’s Nihon Keizai Newspaper reported recently that Toyota and Honda would release fuel cell vehicles (FCV) in 2015 at a price of 10 million yen ($98,000) or less. This follows a decline in popularity of electric vehicles due to limited range per charge. FCVs use a generator rather than a battery, which means they need to be filled with hydrogen. The current cost of an FCV is more than 1... » read more

ATE Platform Strategy Gains Ground


More than a decade ago, at the urging of Intel, the ATE industry set out to reduce the cost of test in the digital chip market. Backed by companies such as Intel, Motorola, Renesas, Advantest and others, they formed an ATE consortium to make this all work. The aim of the consortium was to devise an "open architecture" for ATE. This would enable the development of third-party plug-and-play m... » read more

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