category: News

category: IoT, Security & Automotive

Chip Industry Week in Review
By The SE Staff - 06 Jun, 2025 - Comments: 0

Global semiconductor sales hit $57 billion for the month of April 2025, a nearly 23% increase compared to April 2024 and a 2.5% increase versus March 2025, reports Semiconductor Industry Association. Here's the regional breakdown of year-over-year sales, in $US billions: Fig. 1: YoY semiconductor revenue and growth. Source: SIA Meanwhile, global semiconductor equipment billings grew 21%... » read more

Blog Review: June 4
By Jesse Allen - 04 Jun, 2025 - Comments: 0

In a podcast, Siemens’ Conor Peick, Dale Tutt, and Mike Ellow chat about the implications of the software-defined transition, how it affects semiconductor development, and why it seems to be leading more companies towards developing their own silicon. Cadence’s Vinod Khera shows off a Linux-based audio development platform for prototyping AI audio applications with support for real-time ... » read more

On The Ground At ECTC 2025
By Gregory Haley - 02 Jun, 2025 - Comments: 0

Senior Executive Editor Laura Peters examines the the hot topics at last week's IEEE's Electronic Components and Technology Conference, including the impact of hardware-software integration on power consumption, co-packaged optics, hybrid bonding, and fan-out panel-level packaging. https://youtu.be/yBDKqrPQBl4   » read more

Chip Industry Week in Review
By The SE Staff - 30 May, 2025 - Comments: 0

The U.S. Commerce Department is tightening controls on EDA software sold to China by imposing additional license requirements. EDA companies are assessing the impact. Details on how broad the restrictions will be are still pending. The U.S. Federal Trade Commission (FTC) will require Synopsys and Ansys to divest key software assets — including optical, photonic, and RTL power analysis tool... » read more

Blog Review: May 28
By Jesse Allen - 28 May, 2025 - Comments: 0

Siemens’ Patrick Hope considers how to fully perform post-route signal integrity verification on PCB designs while maintaining the project’s timeline by implementing a progressive verification methodology that enables signal integrity experts to focus on issues that demand their expertise rather than simple errors. Cadence’s Vanessa Do checks out how CXL addresses the constant demand f... » read more

Inside Chips Podcast: May 27
By Gregory Haley - 27 May, 2025 - Comments: 0

Jo De Boeck, chief strategy officer and EVP at imec, talks with Semiconductor Engineering Technology Editor Gregory Haley about system technology co-optimization and the intersection of technology and AI. https://www.youtube.com/watch?v=XUgQPBIaDHQ » read more

Chip Industry Week in Review
By The SE Staff - 23 May, 2025 - Comments: 0

Podcast: imec's roadmap and a one-on-one interview with the European research house's chief strategy officer. China's Xiaomi debuted an in-house-designed 10-core mobile SoC built on a 3nm process. The company did not identify the foundry. It also announced plans to invest 50 billion yuan (~$7B) over the next decade to develop high-end smartphone chips, as part of a 200 billion yuan (~$28B) c... » read more

Blog Review: May 21
By Jesse Allen - 21 May, 2025 - Comments: 0

Synopsys’ Frank Malloy listens in on a panel discussing the engineering challenges introduced by multi-die designs, from multi-physics interactions that impact power and thermal integrity to the availability of multi-die packages and industry standards. Siemens’ Bruce Caryl shows how to determine how much a design’s power delivery network is contributing to jitter on the output drivers... » read more

Chip Industry Week in Review
By The SE Staff - 16 May, 2025 - Comments: 0

Check out the Inside Chips podcast for our behind-the-scenes analysis. Newly proposed U.S. legislation called the Chip Security Act would use location verification tracking as a tool to help combat chip smuggling. This follows a report by the Economist that showed Taiwan exports of advanced chips to Malaysia in the first quarter has nearly reached 2024 totals, heightening concerns that China... » read more

Blog Review: May 14
By Jesse Allen - 14 May, 2025 - Comments: 0

Siemens’ Stephen V. Chavez finds that proper PCB high voltage spacing between conductive elements is key to reliability and understanding the principles of clearance (through-air spacing) and creepage (along-surface spacing) is critical. Cadence’s Frank Ferro checks out how the new HBM4 standard boosts bandwidth and addresses key issues in the data center, including the growing size of L... » read more

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