Siemens’ Tova Levy finds that heterogeneous integration necessitates a shift to a system-level technology co-optimization approach where power, performance, area, cost, and reliability are considered across various components, including silicon, package, interposer, and PCB.
Synopsys’ Greg Sorber listens in as Arm’s Rene Haas and Synopsys’ Sassine Ghazi discuss the opportunity for AI...
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