Chip Industry Week in Review

By The SE Staff - 27 Jun, 2025 - Comments: 0

AI featured big at this week's Design Automation Conference (DAC) in San Francisco. Dozens of companies featured AI-related tools (see product section below), as well as significant improvements to existing tools and some entirely new approaches for designing chips. Among the highlights: Siemens unveiled an AI-enhanced toolset for the EDA design flow that enables customers to integrate the... » read more

Blog Review: June 25

By Jesse Allen - 25 Jun, 2025 - Comments: 0

Siemens’ John McMillan provides a detailed overview of 3D-IC technology and heterogeneous integration, from the market trends driving its adoption to the design, verification, and manufacturing challenges involved. Synopsys’ Gunnar Braun and Stewart Williams check out how cloud-based development practices and virtual prototypes can enable earlier and more efficient testing and validation... » read more

Chip Industry Week in Review

By The SE Staff - 20 Jun, 2025 - Comments: 0

Texas Instruments will invest more than $60 billion to build and expand seven semiconductor fabs in Texas and Utah, supporting more than 60,000 U.S. jobs. Chinese automakers — including SAIC Motor, Changan, Great Wall Motor, BYD, Li Auto and Geely — are aiming to launch new models with 100% homemade chips, some as early as 2026, reports Nikkei Asia. Marvell introduced 2nm custom SRAM ... » read more

Blog Review: June 18

By Jesse Allen - 18 Jun, 2025 - Comments: 0

Synopsys’ John Koeter and other industry experts discuss whether high-bandwidth memory should follow established standards for broad compatibility and scalability or be customized to address specific use case requirements and time-to-market targets. In a podcast, Siemens’ Conor Peick, Dale Tutt, and Mike Ellow chat about how progress in 3D-IC development, thermal management, and the indu... » read more

Chip Industry Week in Review

By The SE Staff - 13 Jun, 2025 - Comments: 0

The Chinese Academy of Sciences unveiled a fully automated processor chip design system, claiming the potential to accelerate semiconductor development and replace human programmers. Micron Technology plans to expand its U.S. investments to approximately $150 billion in domestic memory manufacturing and $50 billion in R&D, which is $30 billion higher than previously reported. AMD laun... » read more

Chip Industry Week in Review

By The SE Staff - 06 Jun, 2025 - Comments: 0

Qualcomm announced plans to buy Alphawave Semi for ~$2.4 billion in a deal expected to close in Q1 2026. Qualcomm plans to leverage Alphawave Semi's connectivity products, including chiplets, to develop high-performance, low-power solutions for AI inferencing and customized CPUs in data centers. Qualcomm's traditional targets were mobile phones and edge computing. [Updated 6/9.] Global semic... » read more

Blog Review: June 4

By Jesse Allen - 04 Jun, 2025 - Comments: 0

In a podcast, Siemens’ Conor Peick, Dale Tutt, and Mike Ellow chat about the implications of the software-defined transition, how it affects semiconductor development, and why it seems to be leading more companies towards developing their own silicon. Cadence’s Vinod Khera shows off a Linux-based audio development platform for prototyping AI audio applications with support for real-time ... » read more

On The Ground At ECTC 2025

By Gregory Haley - 02 Jun, 2025 - Comments: 0

Senior Executive Editor Laura Peters examines the the hot topics at last week's IEEE's Electronic Components and Technology Conference, including the impact of hardware-software integration on power consumption, co-packaged optics, hybrid bonding, and fan-out panel-level packaging. https://youtu.be/yBDKqrPQBl4 » read more

Chip Industry Week in Review

By The SE Staff - 30 May, 2025 - Comments: 1

The U.S. Commerce Department is tightening controls on EDA software sold to China by imposing additional license requirements. EDA companies are assessing the impact. Details on how broad the restrictions will be are still pending. The U.S. Federal Trade Commission (FTC) will require Synopsys and Ansys to divest key software assets — including optical, photonic, and RTL power analysis tool... » read more

Blog Review: May 28

By Jesse Allen - 28 May, 2025 - Comments: 0

Siemens’ Patrick Hope considers how to fully perform post-route signal integrity verification on PCB designs while maintaining the project’s timeline by implementing a progressive verification methodology that enables signal integrity experts to focus on issues that demand their expertise rather than simple errors. Cadence’s Vanessa Do checks out how CXL addresses the constant demand f... » read more

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