Chip Industry Week in Review


Advanced nodes and capacity The US Commerce Dept. told IC equipment makers to stop shipments to Hua Hong Group, China's No. 2 chipmaker, in order to protect America's lead, according to Reuters. Global AI competition is causing wafer and packaging shortages, but capacity increases are expected to come online later this year and in 2027 to ease the crunch, according to TrendForce. Leadi... » read more

Blog Review: Apr. 29


Synopsys' Madhumita Sanyal shows why interface IP has emerged as the keystone for building scalable, reliable 3D multi-die designs in which interconnects often have a greater influence on overall system capability than the peak performance of individual dies. Cadence's Frank Ferro checks out why SOCAMM2 built on LPDDR is being deployed in AI data centers, increasing memory bandwidth and capa... » read more

Chip Industry Week In Review


Deals Marvell acquired Polariton Technologies, a Swiss developer of plasmonics-based silicon photonics devices. Onto Innovation is partnering with Rigaku, combining Onto’s analysis software with Rigaku’s CD-SAXS platform for advanced semiconductor process control. Onto also agreed to acquire a 27% stake in Rigaku for about $710M. Tesla plans to use Intel’s 14A process for its T... » read more

Blog Review: Apr. 22


In a podcast, Siemens EDA's Harry Foster and Vladislav Palfy chat about why coverage closure has become one of the biggest bottlenecks in modern verification and how a unified approach that combines planning, automation, and analytics helps teams break through coverage plateaus. Synopsys' Emily Gerken and Marc Swinnen consider the challenges of designing analog and mixed-signal circuits at a... » read more

Chip Industry Week In Review


Acquisitions and business pivots Teradyne acquired Israel-based TestInsight, a semiconductor test provider with pattern conversion, validation, and virtual test capabilities. Credo plans to acquire DustPhotonics, a developer of silicon photonics PICs for optical transceivers. Molex plans to acquire Teramount, a provider of detachable, passive-alignment fiber-to-chip connectivity solu... » read more

Blog Review: Apr. 15


Cadence's Wilson Kobalkar shares why eUSB2‑V2 represents a major evolutionary step for the USB 2.0 ecosystem, including how it achieves multi‑gigabit HSx operation and why symmetric/asymmetric modes unlock new design possibilities. Synopsys' Akanksha Soni explains the difference between metal-oxide-metal, metal-insulator-metal, and metal-oxide-semiconductor capacitors, identifying the ad... » read more

EDA And IP Numbers Up Again, But Numbers Are More Nuanced


EDA and Semiconductor IP revenue grew 10.3% in Q4 2025 to $5.466 billion, up from $4.955 billion in the same period in 2024, continuing the double-digit run for the tools and IP business that has been underway for the past few years. CAE, the largest EDA category, rose 9.4% to $2.083 billion in Q4, versus $1.761 billion in Q4 2024. Non-reporting IP companies — a segment dominated by Arm �... » read more

Chip Industry Week In Review


Deals, Funding Intel will join Elon Musk’s Terafab chip manufacturing project alongside Tesla, SpaceX, and xAI. Intel described its role as helping refactor silicon fab technology for a project targeting production of 1 TW/year of compute for AI and robotics applications. Intel and Google are expanding a multi-year collaboration on AI and cloud infrastructure, with Intel Xeon processo... » read more

Blog Review: Apr. 8


Cadence's Shyam Sharma highlights new capabilities in LPDDR6, including metadata built into the data packets, rowhammer mitigations, DVFS with support for three operating voltage rails, and new efficiency modes. Synopsys' Akanksha Soni points to multiphysics simulation as a key element of ensuring automotive IC designs meet ISO 26262 requirements. Siemens' John McMillan suggests a simulat... » read more

Chip Industry Week In Review


Deals IBM and Arm are collaborating on a new dual‑architecture hardware aimed at enterprise AI and data-intensive workloads, using virtualization to boost reliability, security, scalability, and software compatibility. The goal, according to an IBM spokesperson, is to deliver side-by-side deployments of S390x-Linux and Arm-Linux virtual machines in a single kernel-based hypervisor. Nv... » read more

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