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Week In Review: Manufacturing, Test


Packaging and test Taiwan’s ASE--the world’s largest OSAT--has announced the proposed sale and disposal of equity interests in its subsidiaries, GAPT Holding and ASE (Kun Shan), to Wise Road Capital, a private equity firm based in China. The deal has a value of $1.46 billion. The announcement is related to four ASE assembly and test facilities in China, including Shanghai, Suzhou, Kunsh... » read more

Week In Review: Design, Low Power


Infineon Technologies acquired Syntronixs Asia, which specializes in precision electroplating, a key process in the assembly process of semiconductors. Syntronixs Asia has a workforce of more than 500 people and has been a major service provider for Infineon since 2009. “Through this acquisition, we have made another important step to strengthen the resilience of our supply chain,” said Tho... » read more

Week In Review: Auto, Security, Pervasive Computing


Automotive The U.S. Federal Trade Commission (FTC) sued Nvidia to block the company’s $40 billion acquisition of Arm. The FTC said in a press statement that “the proposed vertical deal would give one of the largest chip companies control over the computing technology and designs that rival firms rely on to develop their own competing chips. … the combined firm would have the means and in... » read more

Blog Review: Dec. 1


Synopsys' Mike Gianfagna points to three events that created a fundamental shift in product development that has enabled rapid introduction of a wide range of new products. Siemens' Sagi Reuven considers some key challenges facing the supply chain and the impact on electronics manufacturers, from rising shipping costs to shortages of raw materials and transportation labor. Cadence's Frank... » read more

Blog Review: Nov. 24


Cadence's Paul McLellan introduces the theory and practice of datapath formal verification and explores two use cases of dot-product accumulate systolic design and hashing design. Siemens EDA's Rich Edelman shows that constructing an in-order UVM scoreboard doesn't have to be a difficult or complex task, and certainly simpler than replacing a laptop's keyboard. Synopsys' Gordon Cooper con... » read more

Week In Review: Manufacturing, Test


Chipmakers China’s Tsinghua Unigroup is in trouble. The group is the parent company of China’s YMTC, a 3D NAND supplier, and other chip ventures. It is close to moving into bankruptcy proceedings. Now, a consortium led by Alibaba has emerged as the frontrunner to take over Tsinghua Unigroup, according to a report from Bloomberg. That deal would keep the company afloat, the report said. ... » read more

Week In Review: Design, Low Power


Tools Imperas Software released updated simulator and reference models that support the latest RISC-V extensions for Bit Manipulation 1.0.0, Cryptographic (Scalar) 1.0.0, and Vector 1.0, plus Privilege Specification 1.12. They are offered both as freely available, open-source reference models for the RISC-V community as well as commercial products. Ansys' multiphysics signoff solutions were... » read more

Week In Review: Auto, Security, Pervasive Computing


3D-ICs Samsung Foundry released 3D-IC EDA flows approvals. 3D-ICs, which are the multi-dies stacked together and integrated into a package, are finding use in automotive, high-performance computing, and artificial intelligence systems. Samsung Foundry qualified Cadence’s 2D-to-3D native 3D partitioning flow for 3D-IC design that automates creating a memory-on-logic 3D stacking configuration,... » read more

Blog Review: Nov. 17


In a podcast, Arm's Geof Wheelwright and Hilary Tam chat about the importance of efforts to decarbonize compute and how low-power compute can help ensure that the benefits of technology outweigh the environmental cost. Synopsys' Graham Allan and Vikas Gautam consider what's driving demand for HBM3, what's different from the previous HBM2E specification, unique design considerations, and how ... » read more

Week In Review: Manufacturing, Test


Chipmakers AMD has rolled out its new MI200 series products, the first exascale-class GPU accelerators. Using a fan-out bridge packaging technology, the MI200 series are designed for high-performance computing (HPC) and artificial intelligence (AI) applications. The MI200 series accelerators feature a multi-die GPU architecture with 128GB of HBM2e memory. Typically, the HBM2e memory stack a... » read more

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