category: News

category: IoT, Security & Automotive

Blog Review: July 17
By Jesse Allen - 17 Jul, 2019 - Comments: 0

Mentor's John McMillan takes a look at the three general classes that have been established by IPC-2221B to reflect progressive increases in sophistication, functional performance requirements, and testing/inspection frequency for PCBs. Synopsys' Dinesh Siwal and Thenmozhy Kaliyamurthy point out the new features and improvements in DisplayPort 2.0, including greater speeds, better power effi... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 12 Jul, 2019 - Comments: 0

Semi takeover targets Semiconductor M&A activity is heating up again. So who is next? “Within our coverage universe, we believe AMBA (Ambarella) and SLAB (Silicon Labs) represent the most likely targets moving forward,” according to KeyBanc in a research note. KeyBanc also listed some other “M&A Combinations That Could Make Sense.” Some of these combos make sense, while othe... » read more

Week In Review: Design, Low Power
By Jesse Allen - 12 Jul, 2019 - Comments: 0

Synopsys unveiled the latest version of its IC Compiler II place-and-route system, adding a common physical optimization infrastructure, new arc-based unified concurrent clock-and-data (CCD) optimization, physically-aware logic re-synthesis, and dynamic voltage drop-driven power shaping. Additionally, next-generation distributed parallelization, intelligent scenario management, efficient infras... » read more

Week in Review: IoT, Security, Auto
By Jeff Dorsch - 12 Jul, 2019 - Comments: 0

Products/Services Arteris IP reports that Bitmain licensed the Arteris Ncore Cache Coherent Interconnect intellectual property for use in its next-generation Sophon Tensor Processing Unit system-on-a-chip devices for the scalable hardware acceleration of artificial intelligence and machine learning algorithms. “Our choice of interconnect IP became more important as we continued to increase t... » read more

Blog Review: July 10
By Jesse Allen - 10 Jul, 2019 - Comments: 0

Synopsys' Eric Huang takes a look at how backward compatibility with USB 2.0 is provided when the IO voltages of new nodes can't support 3.3V signaling and how eUSB2 can boost the signal and provide support for external or legacy peripherals. In a video, Mentor Colin Walls explains endianness in embedded systems with a look at what it is, when it matters, and how to accommodate it in code. ... » read more

EDA, IP Grow 16.3%
By Ed Sperling - 08 Jul, 2019 - Comments: 0

EDA and IP revenue rebounded in Q1, with all geographies reporting increases, according to the ESD Alliance Market Statistics Service. Total revenue increased to 16.3% to $2.606 billion, up from $2.241 billion in the same period in 2018. The global numbers do not reflect the impact of a trade war between the United States and China, which occurred in Q2, but they do point to a significant re... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 05 Jul, 2019 - Comments: 0

Fab tools and materials Applied Materials has signed a definitive agreement to acquire Kokusai Electric for $2.2 billion in cash from investment firm KKR. With the acquisition of Kokusai’s semiconductor equipment unit, Applied expands its customer base and gains a foothold in the batch processing equipment business, where a tool can process wafers in parallel. Applied’s strength is in the ... » read more

Week in Review – IoT, Security, Auto
By Jeff Dorsch - 05 Jul, 2019 - Comments: 0

Products/Services Synopsys announced successful deployment of the Synopsys Yield Explorer yield learning platform for fast ramp-up of new products on Samsung's advanced finFET technology nodes. Using the secure data exchange mechanism in Yield Explorer, Samsung is able to share the data required for yield analysis, such as chip design, fab, and test, with its customers while maintaining the co... » read more

Week In Review: Design, Low Power
By Jesse Allen - 05 Jul, 2019 - Comments: 0

Si2's Unified Power Model has been approved as IEEE 2416-2019, a new Standard for Power Modeling to Enable System Level Analysis, which complements UPF/IEEE 1801-2018. UPM/IEEE 2416-2019 provides a set of power modeling semantics enabling system designers to model entire systems with flexibility. It supports power modeling from abstract design description to gate level implementation, providing... » read more

Blog Review: July 3
By Jesse Allen - 03 Jul, 2019 - Comments: 0

Cadence's Paul McLellan digs into 5G with a two-part post explaining the basics of the technology, what makes it so different from 4G, and the challenges ahead including the limitations of mmWave. Synopsys' Vikramjeet Bamel and Pankaj Sharma note the features that make GDDR6 a dominant memory in the high performance segment and allowing it to expand beyond graphics to automotive, AI, and AR/... » read more

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