category: News

category: IoT, Security & Automotive

Chip Industry Week In Review
By The SE Staff - 19 Apr, 2024 - Comments: 0

SK hynix and TSMC plan to collaborate on HBM4 development and next-generation packaging technology, with plans to mass produce HBM4 chips in 2026. The agreement is an early indicator for just how competitive, and potentially lucrative, the HBM market is becoming. SK hynix said the collaboration will enable breakthroughs in memory performance with increased density of the memory controller at t... » read more

Blog Review: April 17
By Jesse Allen - 17 Apr, 2024 - Comments: 0

Siemens' Sumit Vishwakarma highlights the importance of crystal oscillators to the proper functioning of many semiconductor devices and applications, from clock signals to transmission and reception of radio waves. Cadence's Jay Domadia introduces some of the new features in GDDR7, such as a semi-independent row and column command address bus and two modes of data signaling, enabling PAM3 fo... » read more

Chip Industry Week In Review
By The SE Staff - 12 Apr, 2024 - Comments: 0

Applied Materials may scale back or cancel its $4 billion new Silicon Valley R&D facility in light of the U.S. government's recent announcement to reduce funding for construction, modernization, or expansion of semiconductor research and development (R&D) facilities in the United States, according to the San Francisco Chronicle. TSMC could receive up to $6.6 billion in direct funding... » read more

Blog Review: April 10
By Jesse Allen - 10 Apr, 2024 - Comments: 0

Cadence's Shyam Sharma looks at the evolution of the LPDDR standard and finds that LPDDR5X is opening new specialized markets for low-power DRAMs beyond the traditional areas of mobile, IoT, and automotive. Siemens' Hossam Sarhan and Dusan Petranovic find that new physical verification approaches are needed to ensure the performance and reliability of superconducting ICs and introduce a hybr... » read more

Chip Industry Week In Review
By The SE Staff - 05 Apr, 2024 - Comments: 0

By Jesse Allen, Gregory Haley, and Liz Allan. The Japanese government approved $3.9 billion in funding for chipmaker Rapidus to expand its foundry business, of which 10% will be invested in advanced packaging. This is in addition to the previously announced $2.18 billion in funding. In a meeting next week, the U.S. and Japan are expected to cooperate on increasing semiconductor development a... » read more

Blog Review: Apr. 3
By Jesse Allen - 03 Apr, 2024 - Comments: 0

Siemens' Keith Felton finds that high bandwidth memory integration poses significant challenges for package designers stemming from its unique architecture and stringent performance requirements. Synopsys' Gervais Fong finds out what's new in the USB4 v2 specification, some of its unique challenges involved in doubling the performance capabilities of the USB wired connection, and an intrigui... » read more

Chip Industry Week In Review
By The SE Staff - 29 Mar, 2024 - Comments: 0

By Adam Kovac, Karen Heyman, and Liz Allan.  China introduced strict procurement guidelines aimed at blocking the use of AMD and Intel processors in government computers. Meanwhile, China urged the Netherlands to ease restrictions on deep ultraviolet (DUV) litho equipment, according to Nikkei Asia. DUV is an older technology, based on 193nm ArF lasers, but in conjunction with multi-p... » read more

Blog Review: Mar. 27
By Jesse Allen - 27 Mar, 2024 - Comments: 0

Cadence's Steve Brown suggests that multi-die technologies will be a key part of the path toward a faster, more efficient chip ecosystem that can support the compressed development cycles now emerging in the automotive industry. Synopsys' John Swanson, Madhumita Sanyal, and Priyank Shukla point to the role of simulation in ensuring seamless operation in the Ethernet ecosystem though rigorous... » read more

Chip Industry Week In Review
By The SE Staff - 22 Mar, 2024 - Comments: 0

By Adam Kovac, Gregory Haley, and Liz Allan. The U.S. government released a 61-page report, titled "National Strategy on Microelectronics Research,” by the Subcommittee On Microelectronics Leadership. It provides a framework for government, industry, academia, and international allies to address four major goals. Synopsys  acquired Intrinsic ID, which develops physical unclonable func... » read more

Blog Review: March 20
By Jesse Allen - 20 Mar, 2024 - Comments: 0

Synopsys' Kiran Vittal delves into AI chips, including the expansion of chip design beyond traditional semiconductor companies, adoption of RISC-V, and the use of formal equivalence checking to verify complex AI datapaths. Siemens' Patrick McGoff points to a survey that suggests projects deploying design for manufacturing within a PCB design flow are more likely to be completed on-time, on-q... » read more

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