Flash Memory Market Ushered In Fierce Competition With The Digitalization Of Electric Vehicles

By Craig Huang - 03 Aug, 2023 - Comments: 0

By Craig Huang and Yulia Lee Governments worldwide have been paying close attention to alternative energy vehicles recently. Many have launched related electric vehicle subsidy policies, accelerating global sales over recent years. In 2021 at IAA Mobility in Munich, Germany, many major car manufacturers, including Porsche, showcased their all-electric or related concept cars. In addition ... » read more

Verifying Low-Temperature Soldering Compliance For CO2 Savings And Enhanced Product Performance

By William Chen - 01 Jun, 2023 - Comments: 0

In a conventional lead-free soldering process reflow ovens operate continuously at about 260°C. An effective alternative capable of operating at a lower temperature could significantly reduce the running costs and CO2 emissions associated with electronic manufacturing. There are also advantages to be gained from the reduction in the thermal stresses imposed on circuit boards and components by ... » read more

The Hidden Security Risks Of Automotive Electronic Systems

By Adrian Cosoroaba - 06 Apr, 2023 - Comments: 0

The Internet of things (IoT) is driving new capabilities that are transforming how we live, work and play. However, as our lives become more connected, the risk from hackers and other security breaches increases with every new IoT device. While most of us are pretty well versed in why we need to keep our most trusted devices secure – such as cell phones and laptops – we often don’t think ... » read more

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

NAND Flash Targets 1,000 Layers

New techniques go beyond improved deposition and etching, but challenges stack up, too.

by Bryon Moyer

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

New AI Processors Architectures Balance Speed With Efficiency

Hot Chips 24: Large language models ratchet up pressure for sustainable computing and heterogeneous integration; data management becomes key differentiator.

by Ed Sperling

category: Memory Of Everything

category: IoT, Security & Automotive

Flash Memory Market Ushered In Fierce Competition With The Digitalization Of Electric Vehicles

Verifying Low-Temperature Soldering Compliance For CO2 Savings And Enhanced Product Performance

The Hidden Security Risks Of Automotive Electronic Systems