Developing Systems For Heterogeneous Integration: Insights From HiCONNECTS

The European semiconductor ecosystem continues to evolve, driven by the ambitions outlined in the EU Chips Act. With goals to strengthen Europe’s technological leadership and double its semiconductor manufacturing market share to 20% by 2030, collaboration across the value chain is imperative. Heterogeneous Integration for Connectivity and Sustainability (HiCONNECTS), a Horizon Europe-funded project, exemplifies this collaborative spirit. The initiative aims to develop next-generation electronic components and systems using advanced heterogeneous integration core technology solutions.

The HiCONNECTS consortium, comprising 65 partners with diverse expertise, is addressing key societal and industrial challenges. These efforts focus on advancing core technology solutions for energy-efficient, high-performance wireless and wired cloud and edge computing, as well as automotive radar systems.

“Collaborating with 65 partners is no small feat—it’s akin to orchestrating a complex IT network,” says Ilan Englard, Coordinator of the HiCONNECTS project. “We streamline progress by creating local networks of partners, all interconnected through a central management framework of tasks, work packages, and coordination. Such large consortia form intricate systems where complexity fosters innovation, often leading to surprising and transformative outcomes.”

As the three-year project progresses, HiCONNECTS is working to establish pilot lines focused on key areas:

• RF Electronic Heterogeneous Integration
• Photonic Components for Heterogeneous Integration
• Advanced Packaging for Heterogeneous Integration

These pilot lines, led by organizations such as the Ferdinand Braun Institute and imec, will develop systems and modules through advanced equipment development, manufacturing optimization, and integration of electronic and photonic components. Validation of equipment in integrated process flows will further enhance the heterogeneous integration landscape.

Now in its third year, HiCONNECTS continues to welcome new members. This inclusiveness underscores the project’s flexibility and its commitment to incorporating fresh perspectives as new trends and challenges emerge. At the 12-month consortium meeting in Catania last February, Arbonaut was unanimously inducted to contribute to the forest fire use case, further expanding the project’s scope.

“The upcoming months are critical, as we move closer to delivering modules, systems, and demonstrators,” says Englard. “Our goal is to heterogeneously integrate the next generation of RF, electronic, and photonic components into networking, telecom, and radar systems, with support from module and equipment makers.”

HiCONNECTS members at the 12-month consortium meeting in Catania, February 2024.

As this ambitious work progresses, sharing project results and achievements remains a top priority for the consortium to ensure meaningful social, political, and economic impact. By drawing attention to the results of the project, the consortium enhances the visibility, comprehension, and implementation of these advancements. Recently, four partners—Excillum, TNO, SANLAB, and Centria University of Applied Sciences—participated in a webinar titled “Heterogeneous Integration for Future High Speed Communication,” organized by SEMI Europe. The webinar is now available on demand for viewers worldwide.

The significance of HiCONNECTS was further highlighted at SEMICON Europa 2024, where seven consortium members presented progress on topics ranging from advanced packaging to photonic integration. At the TechARENA, representatives from SEMI Europe, Excillum, Centria, Arbonaut, AT&S, imec, and Applied Materials showcased the project’s contributions to the semiconductor ecosystem.

“I was thrilled to present at the TECHArena and engage with the HiCONNECTS partners,” said Julius Hållstedt, Head of Segment – Semi & Electronics, Excillum. “I especially appreciated the high attendance at my talk, which validated the strong interest in X-ray solutions for semiconductor applications. The insightful discussions at the SEMICON Europa exhibition and advanced packaging conference was a rewarding bonus.”

HiCONNECTS speakers at SEMICON Europa 2024.

By disseminating research and breakthroughs across various channels, such as publications, webinars, and conferences, HiCONNECTS is promoting knowledge sharing and fostering collaboration across the semiconductor ecosystem. This openness accelerates the adoption of new technologies, ensuring that European industry players remain at the forefront of critical advancements. Furthermore, sharing these results strengthens Europe’s position as a hub for cutting-edge research and development, driving both economic growth and technological leadership on the global stage.

SEMI Europe is proud to be a consortium member of HiCONNECTS under the Chips Joint Undertaking (Chips JU), which is funded by the EU Horizon Europe program and supported by numerous countries, including Austria, Italy, Germany, and Sweden.

About HiCONNECTS: HiCONNECTS (Heterogeneous Integration for Connectivity and Sustainability) is a three-year project bringing together 65 partners to develop sustainable, energy-efficient cloud and edge computing platforms. The project focuses on high-performance computing, storage infrastructure, network interfaces, and real-time analysis of IoT sensors and big data.