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Advancing 3D Integration


Jerry Tzou's recent presentation on 3D Fabric Technology was all about More than Moore. TSMC has other specialized technologies such as RF and eNVM, but this is a general foundational technology for hyperscale data centers, mobile, and AI. Jerry started with the motivation for using chiplets and heterogeneous chip integration. You can see in the diagram below on the left where die from node... » read more

Wafer Prep Key To Thinning SiP


In its ongoing push to create smaller, thinner, and denser chip packages, the semiconductor industry has intensified its focus on integrating separately manufactured components with different functionalities into systems-in-package (SIPs). Known as heterogeneous integration (HI), this approach now drives the industry’s roadmap for advancement. SiPs enable power-efficient, high-bandwidth conne... » read more