5G Gets Closer To Commercialization

By Robert Vamosi - 02 Aug, 2018 - Comments: 0

Cellular carriers would like to have their new 5G networks up by the end of 2018 or early 2019. One problem: they need a set of standards to create the new technology. In June, tech representatives met and made significant first step for technology companies to start building out the necessary 5G chips and software. In La Jolla, California, the 3rd Generation Partnership Project (3GPP) met f... » read more

The Week in Review: IoT

By Jeff Dorsch - 22 Dec, 2017 - Comments: 0

Finance Robert Bosch Venture Capital has purchased a significant number of IOTA tokens from the IOTA Foundation, making a cryptocurrency investment in blockchain technology and the Internet of Things. IOTA provides distributed ledger technology, enabling secure machine-to-machine transactions in data and money, with the foundation charging a micro fee for the service. Riot Blockchain report... » read more

The Case For Narrowband-IoT

By Gale Morrison - 08 Mar, 2017 - Comments: 0

Cellular network-based Narrowband IoT (NB-IoT) is marching closer to reality as players across the ecosystem put forth silicon IP, software protocol stacks, carrier network software upgrades and more. The kicker came last year when the 3rd Generation Partnership Project (3GPP), the global cellular industry standards body, finalized a NB-IoT standard in its 'release 13.' With that, device mak... » read more

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Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: 3GPP

5G Gets Closer To Commercialization

The Week in Review: IoT

The Case For Narrowband-IoT