WiFi Evolves For The IoT

By Bryon Moyer - 06 Aug, 2020 - Comments: 0

WiFi is everywhere, and it’s the most prevalent of the communication protocols that use unlicensed spectrum. But as a common protocol for the Internet of Things (IoT), it faces challenges both because of congestion and the amount of energy it consumes. Two new approaches aim to address those concerns. One is to use multiple channels at once. The second involves the new 802.11ah HaLow stand... » read more

HD Video Comes To Entry-Level Drones

By Sree Durbha - 09 Jul, 2018 - Comments: 0

The consumer drone market has expanded greatly over the last few years, with almost 3 million units shipped during 2017. This upward trend is likely to continue. Analyst firm Statista forecasts that the commercial drone business will be worth $6.4 billion annually by 2020, while Global Market Insights has predicted that the worldwide drone market will grow to $17 billion (with the consumer cate... » read more

Following The WLAN Alphabet To Lower Power

By Ed Sperling - 20 Aug, 2009 - Comments: 0

By Cheryl Ajluni The quest for low power in electronic devices is one that shows no sign of abating any time soon. Pressure for it comes from many different sources, such as the continual drive to pack more functionality into ever smaller, mobile electronic devices. To try and maintain a decent battery life for today’s power-hungry “road-warriors,” engineers have to reduce power con... » read more

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: 802.11n

WiFi Evolves For The IoT

HD Video Comes To Entry-Level Drones

Following The WLAN Alphabet To Lower Power