Chip Industry Week In Review

By The SE Staff - 02 Feb, 2024 - Comments: 0

By Jesse Allen, Gregory Haley, and Liz Allan. Cadence introduced an AI-based thermal stress and analysis platform aimed at 2.5D and 3D-ICs, and cooling for PCBs and electronic assemblies. The company also debuted a HW/SW accelerated digital twin solution for multi-physics system design and analysis, combining GPU-resident computational fluid dynamics (CFD) solvers with dedicated GPU hardwar... » read more

Preparing For An AI-Driven Future In Chips

By Ed Sperling - 01 Feb, 2024 - Comments: 0

Experts at the Table: Semiconductor Engineering sat down to discuss the impact of AI on semiconductor architectures, tools, and security, with Michael Kurniawan, business strategy manager at Accenture; Kaushal Vora, senior director and head of business acceleration and ecosystem at Renesas Electronics; Paul Karazuba, vice president of marketing at Expedera; and Chowdary Yanamadala, technology s... » read more

Blog Review: Jan. 31

By Jesse Allen - 31 Jan, 2024 - Comments: 0

Synopsys' William Ruby argues for a comprehensive energy-efficient design methodology for automotive ICs as today's vehicles demand ever more computing power to support electrification, communication, and processing of massive amounts of data. Cadence's Mellacheruvu Srikanth finds that verifying all the new features and enhancements across several generations of PCIe while maintaining backwa... » read more

Blog Review: Jan. 24

By Jesse Allen - 24 Jan, 2024 - Comments: 0

Siemens' John McMillan finds that while 3D-IC capabilities are ready for mainstream, mass adoption success depends on how easily, effectively, and efficiently a solution can be delivered and points to five workflow adoption focus areas. Cadence's Andre Baguenie shows how to easily convert a logic signal to an electrical value using Verilog-AMS and the transition filter. Synopsys' Chris Cl... » read more

Blog Review: Jan. 17

By Jesse Allen - 17 Jan, 2024 - Comments: 0

Cadence's Rajneesh Chauhan introduces the Back-Invalidate feature in Compute Express Link (CXL) 3.0 and how it contributes to the efficient functioning of modern data center architectures by upholding cache coherence across multiple hosts and devices. Synopsys' Brett Murdock and Dana Neustadter point out the importance of protecting against DRAM attacks such as Rowhammer, RAMbleed, and cold-... » read more

SoC Telemetry & Performance Analysis Using Statistical Profiling Extension

By Brian Jeff - 11 Jan, 2024 - Comments: 0

The Arm Statistical Profiling Extension (SPE) is an architectural feature designed for enhanced instruction execution profiling within Arm CPUs. This feature has been available since the introduction of the Neoverse N1 CPU platform in 2019, along with performance monitor units (PMUs) generally available in Arm CPUs. An important step in extracting value from capabilities like SPE and PMUs is th... » read more

See The Future of IoT: Planning For Success With Smart Vision

By Arm - 11 Jan, 2024 - Comments: 0

Computer vision devices that can ‘see’ and act on visual information are bringing new efficiencies and functionalities to IoT. But with new opportunities come complexities. The specific features and functionality of smart vision use cases vary widely. Creating a system that catches defects on an assembly line requires different imaging, machine learning, and workloads compared to one ... » read more

Blog Review: Jan. 3

By Jesse Allen - 03 Jan, 2024 - Comments: 0

Siemens' Stephen Ferguson looks at the history of computer aided engineering through the lens of how humans interact with computers, with each development enabling a step change in engineering productivity, and the new era on the horizon. Cadence's Krunal Patel finds that the security of data transmission can be improved by integrating Ethernet with Internet Protocol Security (IPSec), which ... » read more

Dramatic Changes Ahead For Chips And Systems

By Karen Heyman - 21 Dec, 2023 - Comments: 0

Early this year, most people had never heard of generative AI. Now the entire world is racing to capitalize on it, and that's just the beginning. New markets, such as spatial computing, quantum computing, 6G, smart infrastructure, sustainability, and many more are accelerating the need to process more data faster, more efficiently, and with much more domain specificity. Compared to the days ... » read more

2023: A Good Year For Semiconductors

By Brian Bailey - 21 Dec, 2023 - Comments: 0

Looking back, 2023 has had more than its fair share of surprises, but who were the winners and losers? The good news is that by the end of the year, almost everyone was happy. That is not how we exited 2022, where there was overcapacity, inventories had built up in many parts of the industry, and few sectors — apart from data centers — were seeing much growth. The supposed new leaders we... » read more

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