tag: chiplets

AI Accelerator Architectures Poised For Big Changes
By Ann Mutschler - 04 Dec, 2023 - Comments: 5

AI is driving a frenzy of activity in the chip world as companies across the semiconductor ecosystem race to include AI in their product lineup. The challenge now is how to make AI run faster, use less energy, and to be able to leverage it from the edge to the data center — particularly with the rollout of large language models. On the hardware side, there are two main approaches for accel... » read more

Chiplet Architecture: Scalable and Cost-Efficient Systems for Irregular Applications (Princeton)
By Technical Paper Link - 30 Nov, 2023 - Comments: 0

A new technical paper titled "DCRA: A Distributed Chiplet-based Reconfigurable Architecture for Irregular Applications" was published by researchers at Princeton University. Abstract "In recent years, the growing demand to process large graphs and sparse datasets has led to increased research efforts to develop hardware- and software-based architectural solutions to accelerate them. While... » read more

3D-ICs May Be The Least-Cost Option
By Brian Bailey - 30 Nov, 2023 - Comments: 1

When 2.5D and 3D packaging were first conceived, the general consensus was that only the largest semiconductor houses would be able to afford them, but development costs are quickly coming under control. In some cases, these advanced packages actually may turn out to be the lowest-cost options. With stacked die [1], each die is considered to be a complete functional block or sub-system. In t... » read more

Nascent Chiplet Tech Gaining Attention In Defense and Commercial Industries
By Ben Miller - 30 Nov, 2023 - Comments: 0

The economic benefits derived from Moore's Law have changed, and not for the better. This shift – especially on the manufacturing side of system-on-chip (SoC) devices, has both the defense and commercial customers in the semiconductor industry wondering what will come next. One way to extend Moore's Law's cost, feature, and size benefits is with multi-chip technology, now commonly known as... » read more

SoC Integration And Data Transport Architecture Requirements Surge In 2023
By Frank Schirrmeister - 30 Nov, 2023 - Comments: 0

As the holiday season is in full swing, it's retrospection and prediction time! Let's look at what I thought 2023 would look like, review how it turned out, and take a first stab at 2024 predictions. As a spoiler, my biggest surprise was the intensity with which artificial intelligence and machine learning (AI/ML) accelerated since Generative AI was put on the mainstream adoption map last year,... » read more

Building Tomorrow’s Electronics Piece By Piece
By Reela Samuel - 30 Nov, 2023 - Comments: 0

The semiconductor landscape is undergoing a seismic shift as the demand for more powerful and energy-efficient electronic devices reaches new heights. In a recent panel discussion at CadenceLIVE Europe, featuring luminaries such as Kevork Kechichian from Arm, Paul Cunningham from Cadence, Norbert Schuhmann from Fraunhofer, Trent Uehling from NXP, Davide Rossi from the University of Bologna, an... » read more

Chiplets For Generative AI Workloads: Challenges in both HW and SW
By Technical Paper Link - 29 Nov, 2023 - Comments: 0

A new technical paper titled "Challenges and Opportunities to Enable Large-Scale Computing via Heterogeneous Chiplets" was published by researchers at University of Pittsburgh, Lightelligence, and Meta. Abstract "Fast-evolving artificial intelligence (AI) algorithms such as large language models have been driving the ever-increasing computing demands in today's data centers. Heterogeneous c... » read more

Making Heterogeneous Integration More Predictable
By Ed Sperling - 29 Nov, 2023 - Comments: 0

Experts at the Table: Semiconductor Engineering sat down to discuss problems and potential solutions in heterogeneous integration with Dick Otte, president and CEO of Promex Industries; Mike Kelly, vice president of chiplets/FCBGA integration at Amkor Technology; Shekhar Kapoor, senior director of product management at Synopsys; John Park, product management group director in Cadence's Custom I... » read more

A Fast And Unified Toolchain For Rapid Design Space Exploration Of Chiplet Architectures
By Technical Paper Link - 27 Nov, 2023 - Comments: 0

A technical paper titled “RapidChiplet: A Toolchain for Rapid Design Space Exploration of Chiplet Architectures” was published by researchers at ETH Zurich and University of Bologna. Abstract: "Chiplet architectures are a promising paradigm to overcome the scaling challenges of monolithic chips. Chiplets offer heterogeneity, modularity, and cost-effectiveness. The design space of chiplet ... » read more

What Can Go Wrong In Heterogeneous Integration
By Ed Sperling - 15 Nov, 2023 - Comments: 0

Experts at the Table: Semiconductor Engineering sat down to discuss heterogeneous integration with Dick Otte, president and CEO of Promex Industries; Mike Kelly, vice president of chiplets/FCBGA integration at Amkor Technology; Shekhar Kapoor, senior director of product management at Synopsys; John Park, product management group director in Cadence's Custom IC & PCB Group; and Tony Mastroia... » read more

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