Week In Review: Auto, Security, Pervasive Computing

By Susan Rambo - 09 Dec, 2022 - Comments: 0

Pervasive computing Swedish-based Ericsson is selling its IoT business platform to Aeris for an undisclosed amount. Ericsson will transfer its IoT Accelerator and Connected Vehicle Cloud businesses and assets to Aeris, a company that focuses on industrial, automotive, and medical IoT networks. The complexity and fragmentation of the IoT space requires more custom and hands on maintenance. Acco... » read more

The Week in Review: IoT

By Jeff Dorsch - 13 Oct, 2017 - Comments: 0

Market Research International Data Corp. (IDC) forecasts the worldwide Internet of Things market will double from $625.2 billion in 2015 to $1.29 trillion in 2020 for a compound annual growth rate of 15.6%. Aeris collaborated with IDC on its report, which predicts the installed base of IoT endpoints will increase from 12.1 billion at the end of 2015 to more than 30 billion by 2020. Initiati... » read more

Functional Safety Issues Rising

By Ed Sperling - 05 Oct, 2017 - Comments: 0

Developing semiconductors for safety-critical markets such as automotive, industrial and medical involves a growing list of extra steps that need to be taken pre- and post-manufacturing to ensure product integrity, reliability and security. This is causing several significant changes: • Designs are becoming much more complicated because they require such features as failover and redundan... » read more

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: Aeris

Week In Review: Auto, Security, Pervasive Computing

The Week in Review: IoT

Functional Safety Issues Rising