Dealing With AI/ML Uncertainty

By Karen Heyman - 25 Apr, 2024 - Comments: 0

Despite their widespread popularity, large language models (LLMs) have several well-known design issues, the most notorious being hallucinations, in which an LLM tries to pass off its statistics-based concoctions as real-world facts. Hallucinations are examples of a fundamental, underlying issue with LLMs. The inner workings of LLMs, as well as other deep neural nets (DNNs), are only partly kno... » read more

Research Bits: April 23

By Jesse Allen - 23 Apr, 2024 - Comments: 0

Probabilistic computer prototype Researchers at Tohoku University and the University of California Santa Barbara created a prototype of a heterogeneous probabilistic computer that combines a CMOS circuit with a limited number of stochastic nanomagnets. It aims to improve the execution of probabilistic algorithms used to solve problems where uncertainty is inherent or where an exact solution... » read more

Predicting And Preventing Process Drift

By Gregory Haley - 22 Apr, 2024 - Comments: 0

Increasingly tight tolerances and rigorous demands for quality are forcing chipmakers and equipment manufacturers to ferret out minor process variances, which can create significant anomalies in device behavior and render a device non-functional. In the past, many of these variances were ignored. But for a growing number of applications, that's no longer possible. Even minor fluctuations in ... » read more

Advanced Packaging Design For Heterogeneous Integration

By CP Hung - 18 Apr, 2024 - Comments: 0

As device scaling slows down, a key system functional integration technology is emerging: heterogeneous integration (HI). It leverages advanced packaging technology to achieve higher functional density and lower cost per function. With the continuous development of major semiconductor applications such as AI HPC, edge AI and autonomous electrical vehicles, traditional chips are transforming i... » read more

How AI 2.0 Will Shape The Memory Landscape

By Emma-Jane Crozier - 11 Apr, 2024 - Comments: 0

AI is such a big part of our lives that we don’t even think about it as “AI”; it’s simply normal life these days. If you’ve asked your home assistant for the weather, used a search engine, or been recommended something to watch today, then that’s all been AI discretely at work. While these AI-enabled applications represent notable advancements in incorporating intelligence into syst... » read more

MIPI In Next Generation Of AI IoT Devices At The Edge

By Ashraf Takla - 11 Apr, 2024 - Comments: 0

The history of data processing begins in the 1960s with centralized on-site mainframes that later evolved into distributed client servers. In the beginning of this century, centralized cloud computing became attractive and began to gain momentum, becoming one of the most popular computing tools today. In recent years however, we have seen an increase in the demand for processing at the edge or ... » read more

Hybrid Methodology To Extract Kinetic And Magnetic Inductances For Superconductor Technologies

By Siemens EDA - 10 Apr, 2024 - Comments: 0

Integrated circuits (ICs) using superconductors have emerged as the technology of choice for artificial intelligence (AI), data centers, and cloud computing. However, innovative technology requires equally innovative physical verification solutions to ensure that these superconductor ICs deliver the performance and reliability they promise. We introduce an innovative hybrid methodology to extra... » read more

New Strategies For Interpreting Data Variability

By Gregory Haley - 09 Apr, 2024 - Comments: 0

Every measurement counts at the nanoscopic scale of modern semiconductor processes, but with each new process node the number of measurements and the need for accuracy escalate dramatically. Petabytes of new data are being generated and used in every aspect of the manufacturing process for informed decision-making, process optimization, and the continuous pursuit of quality and yield. Most f... » read more

Paradigms Of Large Language Model Applications In Functional Verification

By Siemens EDA - 03 Apr, 2024 - Comments: 0

This paper presents a comprehensive literature review for applying large language models (LLM) in multiple aspects of functional verification. Despite the promising advancements offered by this new technology, it is essential to be aware of the inherent limitations of LLMs, especially hallucination that may lead to incorrect predictions. To ensure the quality of LLM outputs, four safeguarding p... » read more

Cache Coherency In Heterogeneous Systems

By Ed Sperling - 01 Apr, 2024 - Comments: 0

Until recently, coherency was something normally associated with DRAM. But as chip designs become increasingly heterogeneous, incorporating more and different types of compute elements, it becomes harder to maintain coherency in that data without taking a significant hit on performance and power. The basic problem is that not all compute elements fetch and share data at the same speed, and syst... » read more

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Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

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