Startup Funding: June 2023

By Jesse Allen - 10 Jul, 2023 - Comments: 0

June saw several large funding rounds, with seven of at least $100 million. Over half a billion dollars alone went to a Chinese company manufacturing silicon carbide (SiC) power semiconductors. The wide band gap material has seen steady interest from investors, particularly for its potential use in electric vehicles. Another of the month's mega-rounds went to a company designing RISC-V SoCs ... » read more

Startup Funding: February 2022

By Jesse Allen - 07 Mar, 2022 - Comments: 0

Mega-rounds dominated venture funding in February, with ten companies seeing investment of $100 million or more, five of which exceeded $200 million. Automotive was the big winner, with seven of the ten companies involved in either developing ADAS and autonomous driving, building electric vehicles, or making components to go in cars. The largest round of the month falls into that last category,... » read more

Startup Funding: October 2021

By Jesse Allen - 03 Nov, 2021 - Comments: 0

Semiconductor manufacturing and packaging companies caught the attention of investors last month, with funding going to a middle-end-of-line foundry, flexible electronics manufacturer, and fab management software. Two Israeli startups are approaching AI accelerators in very different ways, while battery startups propose a variety of new chemistries in the search for the ideal electric vehicle b... » read more

Knowledge Centers
Entities, people and technologies explored

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

Legacy Process Nodes Going Strong

The critical, and growing, significance of mature node chips and processes.

by Bryon Moyer

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

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Startup Funding: June 2023

Startup Funding: February 2022

Startup Funding: October 2021

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