Week in Review: IoT, Security, Auto

By Jeff Dorsch - 04 Jan, 2019 - Comments: 0

Internet of Things The drone episode last month at Gatwick Airport in the United Kingdom forced the cancellation or diversion of more than 1,000 flights over three days. While local police arrested a couple suspected of being behind the drone flights, they were quickly exonerated and released. Questions remain on how airports should respond to such episodes, which are bound to happen again and... » read more

Week in Review: IoT, Security, Auto

By Jeff Dorsch - 28 Sep, 2018 - Comments: 0

Internet of Things IBM this week launched the Watson Decision Platform for Agriculture, which combines artificial intelligence, Internet of Things technology, and cloud-based offerings, providing insights to farmers through a managed service. Among other features, growers can deploy drones to send photos to the IBM Cloud for AI-based trend analysis and detection of crop diseases. The platform ... » read more

Week in Review: IoT, Auto, Security

By Jeff Dorsch - 29 Jun, 2018 - Comments: 0

Executive Changes Rambus' board of directors named Luc Seraphin, senior vice president and general manager of the company's Memory and Interfaces Division, as interim CEO while it searches for a replacement for Ron Black. The board terminated Black this week, saying the reason for termination did not involve Rambus' financial and business performance. The company also named Mike Noonen as se... » read more

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

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Week in Review: IoT, Security, Auto

Week in Review: IoT, Security, Auto

Week in Review: IoT, Auto, Security