Chip Industry Week in Review
AI export rule to be scrapped; SEMI, EU request; Cadence, Nvidia supercomputer; AI co-processor; Imagination's new GPU; semi sales up; imec, TNO photonics lab; NSF key to national security; flexible packaging control system; SiConic test engineering; USB 4 support; SiC JFETS; magnetic behavior in hematite.
Three-Way Race To 3D-ICs
Intel, TSMC, and Samsung are developing a broad set of technologies and relationships that will be required for the next generation of AI chips.
Chip Industry Week in Review
China's 3nm chip; state of the industry supply chain; imec's next big push; hyper-dimensional AI chip; OpenAI's $6.5B startup deal; Siemens buys Excellicon; chip revenue challenges; France's new OSAT.
Chip Industry Week in Review
Intel's new roadmap; EU chip plan needs work; RISC-V boost; UK IC workforce study; materials and wafer shipments; on-chip PDN sensor; IoT Wi-Fi 7; new e-beam lithography facility; more earning reports; Apple's 19B chips in U.S.
Radiation, Temperature, Power Challenges For Chips In Space
Semiconductors designed for spacecraft face a range of extreme conditions that impact aging. A reliable source of power is also needed.
EUV’s Future Looks Even Brighter
Demand for AI chips is growing exponentially, but costs and complexity limit the technology to a handful of companies. That could soon change.
Startup Funding: Q1 2025
AI chips and data center communications see big funding; 75 startups raise $2 billion.
Chip Industry Week in Review
AI export rule to be scrapped; SEMI, EU request; Cadence, Nvidia supercomputer; AI co-processor; Imagination's new GPU; semi sales up; imec, TNO photonics lab; NSF key to national security; flexible packaging control system; SiConic test engineering; USB 4 support; SiC JFETS; magnetic behavior in hematite.
Advanced Packaging Fundamentals for Semiconductor Engineers
New SE eBook examines the next phase of semiconductor design, testing, and manufacturing.
Linear Pluggable Optics Save Energy In Data Centers
New OIF electrical standards will enable interoperability, adding another option for faster and more efficient data movement.
Chip Architectures Becoming Much More Complex With Chiplets
Options for how to build systems increase, but so do integration issues.
Interconnects Approach Tipping Point
The 10 angstrom node will usher in new architectures, tooling, and materials, forcing a massive change in the way fabs build interconnects.
