Linear Pluggable Optics Save Energy In Data Centers
New OIF electrical standards will enable interoperability, adding another option for faster and more efficient data movement.
EUV’s Future Looks Even Brighter
Demand for AI chips is growing exponentially, but costs and complexity limit the technology to a handful of companies. That could soon change.
Interconnects Approach Tipping Point
The 10 angstrom node will usher in new architectures, tooling, and materials, forcing a massive change in the way fabs build interconnects.
Chip Industry Week In Review
Critical IC mineral concerns; wafer shipments shrink; Europe bets big on AI; new ultrasonic cleaner; high-speed DRAM test; Europe's 6G; HW-assisted verification; India IC grows; NPU acquisition; power spikes in AI workloads.
What’s Next In Advanced Packaging?
Momentum is building for organic interposers, 3D stacking, and photonics, but questions remain about how the industry gets there and what kinds of tradeoffs will be necessary.
NAND Flash Targets 1,000 Layers
New techniques go beyond improved deposition and etching, but challenges stack up, too.
Testing For Thermal Issues Becomes More Difficult
Chiplets, exotic materials, and heterogeneous integration are impacting test coverage.
Auto Chip Aging Accelerates In Hot Climates
New data shows significant reduction in lifespan and potential new security issues as global temperatures rise.
Global IC Fabs And Facilities Report: 2024
Companies poured billions into fabs and facilities around the world as regions continue to build self-sufficiency and form hubs with friendly nations.
Is In-Memory Compute Still Alive?
It hasn’t achieved commercial success, but there is still plenty of development happening; analog IMC is getting a second chance.
Baby Steps Toward 3D DRAM
Stacking layers means a complete architecture rethink.
