Inference Moves To The Network

By Bryon Moyer - 07 May, 2020 - Comments: 0

Machine-learning inference started out as a data-center activity, but tremendous effort is being put into inference at the edge. At this point, the “edge” is not a well-defined concept, and future inference capabilities will reside not only at the extremes of the data center and a data-gathering device, but at multiple points in between. “Inference isn't a function that has to resid... » read more

ML, Edge Drive IP To Outperform Broader Chip Market

By Kevin Fogarty - 03 Oct, 2019 - Comments: 0

The market for third-party semiconductor IP is surging, spurred by the need for more specific capabilities across a wide variety of markets. While the IP industry is not immune to steep market declines in semiconductor industry, it does have more built-in resilience than other parts of the industry. Case in point: The top 15 semiconductor suppliers were hit with an 18% decline in 2019 first-... » read more

150MM Alive and Kicking

By Applied Materials - 21 Feb, 2019 - Comments: 0

Did you think chip making on 150mm wafers was a thing of the past? Think again. Many of the megatrends shaping our collective futures—mobility, autonomous driving and electric vehicles, 5G wireless communications, augmented- and virtual reality (AR/VR), and healthcare—depend on innovations created on the 150mm wafer size. While attention is often riveted on the race to the leading-edge n... » read more

Fundamental Shifts In 2018

By Brian Bailey - 20 Dec, 2018 - Comments: 1

What surprised the industry in 2018? While business has been strong, markets are changing, product categories are shifting and clouds are forming on the horizon. As 2018 comes to a close, most companies are pretty happy with the way everything turned out. Business has been booming, new product categories developing, and profits are meeting or beating market expectations. "2018 was indeed a... » read more

The Week in Review: IoT

By Jeff Dorsch - 20 Apr, 2018 - Comments: 0

Cybersecurity The U.S. and U.K. governments collaborated on an unprecedented message on Monday, together warning that Russian cyberattacks may extend beyond government and private organizations to individual homes and offices. The attacks may focus on Internet of Things devices, said Rob Joyce, the cybersecurity coordinator for the National Security Council, who soon after resigned from the Wh... » read more

The Week in Review: IoT

By Jeff Dorsch - 15 Dec, 2017 - Comments: 1

Products/Services NXP Semiconductors is partnering with Alibaba Cloud, the cloud computing business unit of Alibaba Group, to develop secure smart devices for edge computing. The companies will also work together on Internet of Things offerings. AliOS, the Alibaba IoT operating system, has been integrated with NXP’s application processors, microcontrollers, and Layerscape multicore processor... » read more

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Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: AR/VR

Inference Moves To The Network

ML, Edge Drive IP To Outperform Broader Chip Market

150MM Alive and Kicking

Fundamental Shifts In 2018

The Week in Review: IoT

The Week in Review: IoT