tag: AR/VR

Research Bits: June 18
By Jesse Allen - 18 Jun, 2024 - Comments: 0

Gallium nitride can take the heat Researchers from Massachusetts Institute of Technology (MIT), the UAE's Technology Innovation Institute, Ohio State University, Rice University, and Bangladesh University of Engineering and Technology investigated the performance of ohmic contacts in a gallium nitride (GaN) device at extremely high temperatures, such as those that would be required for devices... » read more

Scheduling Multi-Model AI Workloads On Heterogeneous MCM Accelerators (UC Irvine)
By Technical Paper Link - 24 May, 2024 - Comments: 0

A technical paper titled “SCAR: Scheduling Multi-Model AI Workloads on Heterogeneous Multi-Chiplet Module Accelerators” was published by researchers at University of California Irvine. Abstract: "Emerging multi-model workloads with heavy models like recent large language models significantly increased the compute and memory demands on hardware. To address such increasing demands, designin... » read more

Will 2024 Be The Year Of Layered Realities?
By Frank Schirrmeister - 25 Jan, 2024 - Comments: 0

January is always the month of predictions. Our team has already contributed to Semiconductor Engineering's 2023 Look Back and 2024 Outlook. My personal tradition has become to combine the outlook with a look back at what industry experts thought of a decade ago. While this involved a trip to my garage to pick up the respective January IEEE Spectrum issue a decade ago, the new reality is that a... » read more

Chip Challenges In The Metaverse
By Marie C. Baca and Ed Sperling - 24 Oct, 2022 - Comments: 0

The metaverse is pushing the limits of chip design, despite uncertainty about how much raw horsepower these devices ultimately will require to deliver an immersive blend of augmented, virtual, and mixed reality. The big challenge in developing these systems is the ability to process mixed data types in real time while the data moves uninterrupted at lightning speed. That requires the integra... » read more

Design And Security Challenges for VR
By John Koon - 10 Aug, 2022 - Comments: 0

Virtual reality is no longer just for gamers, and as this technology is deployed in everything from health care to industrial training, the requirements for processing more data faster over a high-speed connection are growing. Designing these devices continues to be a study in contradictions. They must be extremely low power, with a small enough batteries to make them comfortable to wear. Bu... » read more

Internet Tech Trends For 2022
By Paul McLellan - 03 Mar, 2022 - Comments: 0

Every year at the start of the year, Benedict Evans produces a big presentation on trends in technology, internet, mobile, and so on. He used to live in the US and did this for Andreesen-Horowitz (a16z), but he has since returned to Britain (he's English) and I think has his own consulting company. This year's presentation is titled "Three Steps to the Future." The most exciting themes in t... » read more

Dual Mode C-PHY/D-PHY: Enabling Next Generation Of VR Displays
By Mixel - 13 Jan, 2021 - Comments: 0

For many years, Virtual Reality (VR) and Augmented Reality (AR) were strongly linked to gaming and entertainment applications. Today, the VR/AR and their combined version, Mixed Reality (MR), have their applications extended to other domains like healthcare, military, education, manufacturing, retail, marketing and advertising. What are the challenges for next generation VR displays? What makes... » read more

200mm Demand Surges
By Mark LaPedus - 17 Dec, 2020 - Comments: 1

A surge in demand for various chips is causing shortages for select 200mm foundry capacity as well as 200mm fab equipment, and it shows no signs of abating in 2021. Foundry customers will face a shortfall of 200mm capacity at select foundries at least in the first half of 2021, and perhaps beyond. Those customers will need to plan ahead to ensure they obtain enough 200mm capacity in 2021. Ot... » read more

Inference Moves To The Network
By Bryon Moyer - 07 May, 2020 - Comments: 0

Machine-learning inference started out as a data-center activity, but tremendous effort is being put into inference at the edge. At this point, the “edge” is not a well-defined concept, and future inference capabilities will reside not only at the extremes of the data center and a data-gathering device, but at multiple points in between. “Inference isn't a function that has to resid... » read more

ML, Edge Drive IP To Outperform Broader Chip Market
By Kevin Fogarty - 03 Oct, 2019 - Comments: 0

The market for third-party semiconductor IP is surging, spurred by the need for more specific capabilities across a wide variety of markets. While the IP industry is not immune to steep market declines in semiconductor industry, it does have more built-in resilience than other parts of the industry. Case in point: The top 15 semiconductor suppliers were hit with an 18% decline in 2019 first-... » read more

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