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More Than Moore At iMAPS


San Diego recently hosted the 54th International Symposium on Microelectronics. That's a very generic title, so you should know that it is run by iMAPS, the International Microelectronics Assembly and Packaging Society. Generally, the conference is just known as iMAPS. One of the keynotes was given by Cadence's KT Moore (in person). His presentation was titled "More Moore or More than Moore: a... » read more

New Glasses Target Aspects Of AR & VR


Despite all the recent noise about the Metaverse (and Facebook changing its company name to Meta), I remain convinced that augmented reality (AR) is going to be more important than virtual reality (VR), at least in the medium term. For one thing, virtual reality headsets are large and expensive, at least today. I'm also not convinced that we all want to live in a virtual world like that...but I... » read more

The Next Generation Of General-Purpose Compute At Hot Chips


At the recent HOT CHIPS, the first day opened with the chips that you first think of when you hear the word processor. These are the next generation of chips from the likes of Intel, AMD, and IBM. There were lots of other chips too, such as Arm's Neoverse N2, and NVIDIA's new data-processing unit (DPU), or AMD's next-generation graphics architecture. But for this post, anyway, I'm going to focu... » read more

Hyperconnectivity’s Impact On Consumers


Do you know what hyperconnectivity is? It is already affecting you, whether you know it or not. Hyperscalers are the companies like AWS, Google, and Microsoft that build and run those enormous (aka hyperscale) data centers. If you are a designer and use the cloud, then you have at least a vague idea of what data centers are being used to handle your design. But even if you are the generic perso... » read more

Advancing 3D Integration


Jerry Tzou's recent presentation on 3D Fabric Technology was all about More than Moore. TSMC has other specialized technologies such as RF and eNVM, but this is a general foundational technology for hyperscale data centers, mobile, and AI. Jerry started with the motivation for using chiplets and heterogeneous chip integration. You can see in the diagram below on the left where die from node... » read more

National Security And Artificial Intelligence


The (U.S.) National Security Commission on Artificial Intelligence recently published its final report. The report is 756 pages long, so I am not going to claim that I've read it all. I read the introduction and some of the conclusion, and the chapter on microelectronics (basically, semiconductors and advanced packaging). To give you a flavor, here are the opening paragraphs of the "Letter f... » read more

Preventing Online Fraud


I attended a webcast on Anti-Fraud organized by the RSA Conference in the leadup to the conference itself. The anti-fraud webcast was split into two sections. First was Steve Winderfield, who is advisory CISO at Akamai, titled "How We Can Keep up with Cyber-Criminals' Evolving Business Models?" The second part was by Michael Tiffany of White Ops and Chris Ott of Rothwell Figg, titled "Dete... » read more

Die-To-Die Chiplet Communication


At CadenceLIVE Americas 2020, one of the most viewed videos was by Samsung Foundry's Kevin Yee and Cadence's Tom Wong, titled "Let’s Talk About Chips (Chiplets), Baby…It’s All About D2D!" They went for this title because it reminded them of the lyrics of an '80s song...which they proceeded to sing. Process and packaging trends Tom led off with a look at the trends in semiconducto... » read more

Self-Driving Cars In San Francisco


You probably have heard that Waymo has completely driverless (no safety driver) taxis serving Phoenix. 600 of them. But you can't go and buy one. Why is that? Paul Graham, the founder of the incubator Y Combinator, is celebrated for many reasons, but two things he has said have become mantra in the startup world: Build something people want. Do things that don't scale. When it comes ... » read more

The SEMI Industry Strategy Symposium Outlook


In mid-January, SEMI organized the two-day Industry Strategy Symposium. Presentations ranged from the outlook for the overall global economy, to purifying gases and materials to parts per quadrillion, to how TSMC took the leading-edge process crown from Intel. The first day was focused on the economy and business environment, along with its impact on the semiconductor supply chain. The secon... » read more

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