Week In Review: Manufacturing, Test

By Mark LaPedus - 05 Nov, 2021 - Comments: 0

Packaging Amkor plans to build a packaging plant in Bac Ninh, Vietnam. The first phase of the new factory will focus on providing system-in-package (SiP) assembly and test services for customers. The investment for the first phase of the facility is estimated to be between $200 million and $250 million. “This is a strategic, long-term investment in geographical diversification and factory... » read more

Manufacturing Bits: June 1

By Mark LaPedus - 01 Jun, 2021 - Comments: 0

Frozen finFETs The Defense Advanced Research Projects Agency (DARPA) has launched the Low Temperature Logic Technology (LTLT) program, an effort to develop finFETs that operate at temperatures close to liquid nitrogen (~77K or minus 321 degrees Fahrenheit). The goal of LTLT is to develop low-temperature finFET transistors at the 14nm node and below by making modifications to the manufacturi... » read more

Manufacturing Bits: May 28

By Mark LaPedus - 28 May, 2019 - Comments: 0

Swarming autonomous blimps The U.S. Naval Research Laboratory (NRL) is exploring the development of miniature autonomous blimps, a technology that could pave the way towards a new form of military swarming technology. Initially, NRL developed 30 miniature autonomous blimps. The goal is to test the interaction and swarming behavior of these autonomous systems. Georgia Institute of Technology... » read more

Week in Review: IoT, Security, Auto

By Jeff Dorsch - 09 Nov, 2018 - Comments: 0

Internet of Things What’s better than a 5G network? How about a local, private 5G network? The Industrial Internet of Things may drive the development of such networks. Of course, 5G cellular communications technology is still being worked out worldwide. BMW, Daimler, and Volkswagen are looking ahead to the future; those automotive manufacturers notified Germany’s Federal Network Agency th... » read more

Manufacturing Bits: May 5

By Mark LaPedus - 05 May, 2015 - Comments: 0

Transparent armor The U.S. Naval Research Laboratory (NRL) has developed transparent armor. The technology is actually a hard transparent ceramic, based on a material called spinel. Spinel is a magnesium aluminate compound. Spinel is also a gemstone, which could come in various colors. NRL has devised a fabrication process to create the technology, which is harder and superior to glass, sap... » read more

Manufacturing Bits: April 28

By Mark LaPedus - 28 Apr, 2015 - Comments: 0

CIA and 3D printers Voxel8, a supplier of 3D printers, has closed a strategic investment and technology development agreement with In-Q-Tel (IQT), the venture capital arm of the U.S. Central Intelligence Agency (CIA). Voxel8, founded by technologists from Harvard University, is commercializing a new platform for 3D printing. The company enables engineers to create products with embedded 3D ... » read more

Manufacturing Bits: April 21

By Mark LaPedus - 21 Apr, 2015 - Comments: 0

Fan-out packaging consortium A*STAR’s Institute of Microelectronics (IME) and others have formed a high-density fan-out wafer level packaging (FOWLP) consortium in Singapore. Others in the group include Amkor, Nanium, STATS ChipPAC, NXP, GlobalFoundries, Kulicke & Soffa, Applied Materials, Dipsol Chemicals, JSR, KLA-Tencor, Kingyoup Optronics, Orbotech and Tokyo Ohka Kogyo (TOK). T... » read more

Manufacturing Bits: Dec. 16

By Mark LaPedus - 16 Dec, 2014 - Comments: 0

Space DSA NASA's Physical Science Research Program is taking directed self-assembly (DSA) technology to new heights. On the International Space Station, astronauts are exploring the development of nanoparticles suspended in magnetorheolocial (MR) fluids. MR fluids, which are a new class of smart materials, self-assemble into shapes in the presence of a magnetic field. With the technology, r... » read more

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

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