October ’19 Startup Funding: Mega Harvest

By Jeff Dorsch - 11 Nov, 2019 - Comments: 0

Seventeen startups took in mega-rounds of $100 million or more during October, with a cumulative total of just over $3.2 billion. Cybersecurity startups continued to be popular with private investors during the month of October, with 15 financing rounds. Twenty automotive and mobility technology firms picked up new investments. Analytics firms, artificial intelligence/machine learning techno... » read more

February ’19 Startup Funding: Big Cash Keeps Rolling In

By Jeff Dorsch - 07 Mar, 2019 - Comments: 0

Sixteen startups received private funding rounds of $100 million and up during February, including three that took in 10-figure rounds. Those 16 companies raised more than $8 billion in total. The SoftBank Vision Fund invested $1.5 billion in China's Chehaoduo, an online car trading group that includes Guazi.com, a used-car trading platform, and Maodou.com, which retails new sedans through d... » read more

Week in Review: IoT, Security, Auto

By Jeff Dorsch - 31 Aug, 2018 - Comments: 1

Internet of Things Electrolux, Haier, LG Electronics, and Samsung Electronics announced they are working with the Open Connectivity Foundation, an Internet of Things standards body, to build, commercialize, and deploy interoperable OCF-Certified connected products during 2019. In addition, the OCF is launching an enhanced security model and secure cloud management capabilities, making use of p... » read more

Week in Review: IoT, Security, Auto

By Jeff Dorsch - 17 Aug, 2018 - Comments: 0

Cybersecurity Check Point Software Technologies reports that facsimile machines (yes, people still use them!) can be subject to hacking through vulnerabilities in their communication protocols. The HP Officejet Pro All-in-One fax printers and other fax machines can be compromised with a hacker only knowing a fax number, according to the company. Check Point Research says a design flaw in Andro... » read more

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: Aspect Ventures

October ’19 Startup Funding: Mega Harvest

February ’19 Startup Funding: Big Cash Keeps Rolling In

Week in Review: IoT, Security, Auto

Week in Review: IoT, Security, Auto