Startup Funding: December 2022

By Jesse Allen - 04 Jan, 2023 - Comments: 0

The month of December saw six rounds of $100 million or more. The largest, at a massive half-billion dollars, will support manufacturing of 12-inch monocrystalline silicon polished wafers and epitaxial wafers in China. The company is aiming for a production rate of 1 million pieces a month when current expansion is completed. Also in the half-billion club last month is a company making auton... » read more

Startup Funding: May 2020

By Jesse Allen - 08 Jun, 2020 - Comments: 0

It was a good month for semiconductor startups, with investment spanning a larger company in later funding rounds to brand new seed funding for two chip manufacturing startups. Two AI hardware startups bridge data center and edge, plus EV companies around the world get funding. In total, the eighteen startups profiled this month raised $446.3 million. Semiconductor & design Shanghai-based ... » read more

Week in Review: IoT, Security, Auto

By Jeff Dorsch - 20 Jul, 2018 - Comments: 0

Cybersecurity Rambus signed a patent license agreement with Socionext, a designer of system-on-a-chip devices. Socionext will use Rambus technology in memory controllers, serializers/deserializers, and security applications. Netskope acquired Sift Security, adding 10 technical employees to its headcount of more than 500 people; financial terms weren’t revealed. Sift CEO Neil King was tapp... » read more

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: ASR Microelectronics

Startup Funding: December 2022

Startup Funding: May 2020

Week in Review: IoT, Security, Auto