Week In Review: Auto, Security, Pervasive Computing

By Marie C. Baca - 09 Sep, 2022 - Comments: 0

Automotive and mobility Seventeen U.S. states must decide whether or not to follow California's new law that mandates that all new cars, pickups and SUVs be electric or hydrogen-powered by 2035. The Clean Air Act dictates that states must follow federal guidelines unless they follow certain components of California's rules. A research firm says consumers are most passionate about a high-tec... » read more

The Week in Review: IoT

By Jeff Dorsch - 02 Feb, 2018 - Comments: 0

Finance San Francisco-based Aquabyte has raised $3.5 million in seed funding led by Costanoa Ventures and New Enterprise Associates. Princeton University and strategic investors in the U.S. and Norway also participated in the round. The startup is using computer vision and machine learning to optimize efficiency in fish farming. Aquabyte is first deploying its technology in Norway in cooperati... » read more

The Week In Review: IoT

By Jeff Dorsch - 04 Aug, 2017 - Comments: 0

Legislation Four senators plan to introduce a bipartisan bill that would require federal government vendors to provide Internet-connected devices and equipment that is patchable and conforms to industry cybersecurity standards. Such products must not have unchangeable passwords or known security vulnerabilities. The bill was drafted with expert advice from the Atlantic Council and Harvard Univ... » read more

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: asset tracking

Week In Review: Auto, Security, Pervasive Computing

The Week in Review: IoT

The Week In Review: IoT