tag: Atrenta

When Will 2.5D Cut Costs?
By Brian Bailey - 07 Aug, 2014 - Comments: 2

There is a constant drive to reduce costs within the semiconductor industry and, up until now, [getkc id="74" comment="Moore's Law"] provided an easy path to enable this. By adopting each smaller node, transistors were cheaper, but that is no longer the case, as explained in a recent article. The industry will need to find new technologies to make this happen and some people are looking towards... » read more

IP/SoC Verification With Assertions
By Larry Vivolo - 07 Aug, 2014 - Comments: 1

There's been a lot of excitement here in Silicon Valley these past weeks with the opening of the new 49ers stadium. I've always found it amazing to see how so many complex, fundamentally different technologies — mechanical, electrical, HVAC, plumbing, audiovisual, food catering, etc. — can be put together to create a functioning ballpark. It all but takes a mastermind to bring all these eng... » read more

Established Nodes Getting New Attention
By Ed Sperling - 07 Aug, 2014 - Comments: 0

As the price of shrinking features increases below 28nm, there has been a corresponding push to create new designs at established nodes using everything from near-threshold computing to back biasing and mostly accurate analog sensors. The goals of power, performance and cost haven’t changed, but there is a growing realization among many chipmakers that the formula can be improved upon with... » read more

Test Becomes Power-Aware
By Ann Mutschler - 07 Aug, 2014 - Comments: 0

Power-aware test plans are changing, becoming far more extensive than the minimalist plans that were common just a few years ago. In the past would determine if they could power their design up, power it down, then they’d declare it done. “Sometimes they would find they could power it up and power it down once, but they couldn’t power it up a second time because they’d forgotten to ... » read more

Chip Security Features Abound…But Are They Enough?
By Ann Mutschler - 04 Aug, 2014 - Comments: 0

There are a number of security features to protect devices today from attack that SoC design team can include, some of which extract only a small cost to the power and performance. A few of these include the following, according to Bernard Murphy, CTO at Atrenta: --Secure boot, which is a very common thing in embedded systems now in which there are trusted execution environments (TEE) to... » read more

Designing For Security
By Ann Mutschler - 04 Aug, 2014 - Comments: 0

Some level of security is required in SoC today, whether it is in hardware, software or — most commonly — both. Of course, there is a price to pay from a power and performance perspective, but thankfully just a small one in most cases. The explosion of consumer devices has driven the need for increased security features in smart cards, smart phones, personal computers, home networks, and... » read more

IP And FinFETs At Advanced Nodes
By Ed Sperling - 31 Jul, 2014 - Comments: 2

Semiconductor Engineering sat down to discuss IP and finFETs at advanced nodes with Warren Savage, president and CEO of IPextreme; Aveek Sarkar, vice president of engineering and product support at Ansys-Apache; Randy Smith, vice president of marketing at Sonics, and Bernard Murphy, CTO of Atrenta. What follows are excerpts of that conversation. SE: It’s harder for a fabless semiconductor ... » read more

New Winners And Losers
By Brian Bailey - 24 Jul, 2014 - Comments: 0

During DAC 2013, Robert Colwell of DARPA said he was attempting to prepare the U.S. Dept. of Defense for what he believes is the cataclysm caused by the end of [getkc id="74" comment="Moore's Law"]. He asked the question, “What happens when we don’t have a new technology that doubles the number of transistors every couple of years?” Colwell believes that power is the primary reason why... » read more

High-Level Gaps Emerge
By Ann Mutschler - 24 Jul, 2014 - Comments: 0

Semiconductor Engineering sat down to discuss the attributes of a high-level, front-end design flow, and why it is needed at present with Leah Clark, associate technical director for digital video technology at Broadcom; Jon McDonald, technical marketing engineer at Mentor Graphics; Phil Bishop, vice president of the System Level Design System & Verification Group at Cadence; and Bernard Mu... » read more

IP And FinFETs At Advanced Nodes
By Ed Sperling - 21 Jul, 2014 - Comments: 2

Semiconductor Engineering sat down to discuss IP and finFETs at advanced nodes with Warren Savage, president and CEO of IPextreme; Aveek Sarkar, vice president of engineering and product support at Ansys-Apache; Randy Smith, vice president of marketing at Sonics, and Bernard Murphy, CTO of Atrenta;. What follows are excerpts of that conversation. SE: What happens with the next revs of finFET... » read more

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